Issued Patents All Time
Showing 51–75 of 102 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7211890 | Integrating thermoelectric elements into wafer for heat extraction | Shriram Ramanathan, David Chau, Ryan Lei | 2007-05-01 |
| 7170098 | Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat | Abhay Watwe, Sairam Agraharam, Kramadhati V. Ravi, Michael C. Garner | 2007-01-30 |
| 7098079 | Electronic assembly with high capacity thermal interface and methods of manufacture | Abhay Watwe | 2006-08-29 |
| 7082031 | Heatsink device and method | Javier Leija, Ioan Sauciuc | 2006-07-25 |
| 7071552 | IC die with directly bonded liquid cooling device | Kramadhati V. Ravi, Ravi Prasher | 2006-07-04 |
| 7063268 | Electro-active fluid cooling system | Gilroy Vandentop | 2006-06-20 |
| 7034394 | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same | Shriram Ramanathan, Sarah Kim, R. Scott List | 2006-04-25 |
| 7031155 | Electronic thermal management | Ioan Sauciuc | 2006-04-18 |
| 7021891 | Micro-impeller miniature centrifugal compressor | Eduardo Alva Sanchez, James G. Maveety | 2006-04-04 |
| 7012011 | Wafer-level diamond spreader | Chuan Hu | 2006-03-14 |
| 6992382 | Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon | Ravi Prasher | 2006-01-31 |
| 6988531 | Micro-chimney and thermosiphon die-level cooling | James G. Maveety | 2006-01-24 |
| 6981380 | Thermoelectric cooling for microelectronic packages and dice | Paul A. Koning, Saikumar Jayaraman, Makarem A. Hussein | 2006-01-03 |
| 6971442 | Method and apparatus for dissipating heat from an electronic device | Ioan Sauciuc, Ward Scott | 2005-12-06 |
| 6967840 | Clearing of vapor lock in a microchannel cooling subsystem | Ioan Sauciuc | 2005-11-22 |
| 6936497 | Method of forming electronic dies wherein each die has a layer of solid diamond | Kramadhati V. Ravi | 2005-08-30 |
| 6921706 | Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat | Abhay Watwe, Sairam Agraharam, Kramadhati V. Ravi, Michael C. Garner | 2005-07-26 |
| 6862183 | Composite fins for heat sinks | Agostino C. Rinella | 2005-03-01 |
| 6845622 | Phase-change refrigeration apparatus with thermoelectric cooling element and methods | Ioan Sauciuc | 2005-01-25 |
| 6795311 | Method and apparatus for cooling portable computers | Himanshu Pokharna, Eric Distefano | 2004-09-21 |
| 6785134 | Embedded liquid pump and microchannel cooling system | James G. Maveety, Michael C. Garner | 2004-08-31 |
| 6770966 | Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat | Abhay Watwe, Sairam Agraharam, Kramadhati V. Ravi, Michael C. Garner | 2004-08-03 |
| 6706562 | Electronic assembly with high capacity thermal spreader and methods of manufacture | Ravi Mahajan | 2004-03-16 |
| 6661660 | Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment | Ravi Prasher, Abhay Watwe, Kristopher Frutschy, Leo Ofman, Ajit Sathe | 2003-12-09 |
| 6653730 | Electronic assembly with high capacity thermal interface | Abhay Watwe | 2003-11-25 |