| 7842553 |
Cooling micro-channels |
Sarah Kim, Alan M. Myers |
2010-11-30 |
$13,201,000 |
| 7723208 |
Integrated re-combiner for electroosmotic pumps using porous frits |
Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu |
2010-05-25 |
$11,401,000 |
| 7696015 |
Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips |
Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu |
2010-04-13 |
$20,798,000 |
| 7667319 |
Electroosmotic pump using nanoporous dielectric frit |
Alan M. Myers, Quat Vu |
2010-02-23 |
$16,403,000 |
| 7615462 |
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack |
Sarah Kim, Tom Letson |
2009-11-10 |
$23,460,000 |
| 7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu, Ravi Prasher +2 more |
2009-08-18 |
$24,226,000 |
| 7569426 |
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
Alan M. Myers, Gilroy Vandentop |
2009-08-04 |
$15,097,000 |
| 7537954 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
Shriram Ramanathan, Sarah Kim, Gregory M. Chrysler |
2009-05-26 |
$14,272,000 |
| 7355277 |
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package |
Alan M. Myers, Gilroy Vandentop |
2008-04-08 |
$22,423,000 |
| 7348217 |
Method and structure for interfacing electronic devices |
Mauro J. Kobrinsky, Sarah Kim, Michael C. Harmes |
2008-03-25 |
$11,219,000 |
| 7300871 |
Method of doping a conductive layer near a via |
Stefan Hau-Riege |
2007-11-27 |
$22,929,000 |
| 7274106 |
Packaged electroosmotic pumps using porous frits for cooling integrated circuits |
Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu |
2007-09-25 |
$25,540,000 |
| 7227257 |
Cooling micro-channels |
Sarah Kim, Alan M. Myers |
2007-06-05 |
$17,840,000 |
| 7157787 |
Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices |
Sarah Kim, Scot Kellar |
2007-01-02 |
|
| 7148565 |
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack |
Sarah Kim, Tom Letson |
2006-12-12 |
$16,980,000 |
| 7129172 |
Bonded wafer processing method |
Patrick Morrow, Michael Chan |
2006-10-31 |
$18,482,000 |
| 7120817 |
Method of signal distribution based on a standing wave within a closed loop path |
Mauro J. Kobrinsky, Sourav Chakravarty |
2006-10-10 |
$14,351,000 |
| 7105382 |
Self-aligned electrodes contained within the trenches of an electroosmotic pump |
Alan M. Myers, Sarah Kim |
2006-09-12 |
$13,412,000 |
| 7084495 |
Electroosmotic pumps using porous frits for cooling integrated circuit stacks |
Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu |
2006-08-01 |
$14,842,000 |
| 7056813 |
Methods of forming backside connections on a wafer stack |
Patrick Morrow, Sarah Kim |
2006-06-06 |
$10,284,000 |
| 7056807 |
Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack |
Scot Kellar, Sarah Kim |
2006-06-06 |
$10,284,000 |
| 7037804 |
Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration |
Scot Kellar, Sarah Kim |
2006-05-02 |
$12,289,000 |
| 7034394 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
Shriram Ramanathan, Sarah Kim, Gregory M. Chrysler |
2006-04-25 |
$12,896,000 |
| 6992381 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu, Ravi Prasher +2 more |
2006-01-31 |
$19,938,000 |
| 6981849 |
Electro-osmotic pumps and micro-channels |
Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu, Ravi Prasher +1 more |
2006-01-03 |
$22,757,000 |
