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Home › Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack

Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack

US Patent 7148565 · Granted Dec 12, 2006

Estimated economic value: $16,980,000 ⓘ

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