Issued Patents All Time
Showing 26–40 of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6977435 | Thick metal layer integrated process flow to improve power delivery and mechanical buffering | Sarah Kim, Bob Martell, Dave Ayers, Peter K. Moon, Steven Towle | 2005-12-20 |
| 6975016 | Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof | Scot Kellar, Sarah Kim | 2005-12-13 |
| 6908565 | Etch thinning techniques for wafer-to-wafer vertical stacks | Sarah Kim | 2005-06-21 |
| 6897125 | Methods of forming backside connections on a wafer stack | Patrick Morrow, Sarah Kim | 2005-05-24 |
| 6887769 | Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same | Scot Kellar, Sarah Kim | 2005-05-03 |
| 6870270 | Method and structure for interfacing electronic devices | Mauro J. Kobrinsky, Sarah Kim, Michael C. Harmes | 2005-03-22 |
| 6861274 | Method of making a SDI electroosmotic pump using nanoporous dielectric frit | Alan M. Myers, Quat Vu | 2005-03-01 |
| 6833321 | Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability | Stefan Hau-Riege | 2004-12-21 |
| 6790780 | Fabrication of 3-D capacitor with dual damascene process | Sarah Kim, Bruce A. Block | 2004-09-14 |
| 6790748 | Thinning techniques for wafer-to-wafer vertical stacks | Sarah Kim, Mauro J. Kobrinsky | 2004-09-14 |
| 6762076 | Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices | Sarah Kim, Scot Kellar | 2004-07-13 |
| 6664168 | Method of making an on-die decoupling capacitor for a semiconductor device | Ebrahim Andideh | 2003-12-16 |
| 6661085 | Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack | Scot Kellar, Sarah Kim | 2003-12-09 |
| 6645832 | Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack | Sarah Kim, Tom Letson | 2003-11-11 |
| 6059553 | Integrated circuit dielectrics | Changming Jin, Stacey A. Yamanaka | 2000-05-09 |