| 7723208 |
Integrated re-combiner for electroosmotic pumps using porous frits |
Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers |
2010-05-25 |
$11,401,000 |
| 7696015 |
Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips |
Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers |
2010-04-13 |
$20,798,000 |
| 7667319 |
Electroosmotic pump using nanoporous dielectric frit |
R. Scott List, Alan M. Myers |
2010-02-23 |
$16,403,000 |
| 7576432 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Ravi Prasher +2 more |
2009-08-18 |
$24,226,000 |
| 7274106 |
Packaged electroosmotic pumps using porous frits for cooling integrated circuits |
Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers |
2007-09-25 |
$25,540,000 |
| 7189596 |
Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures |
Chun Mu, Qing Ma, Steven Towle |
2007-03-13 |
$17,337,000 |
| 7126207 |
Capacitor with carbon nanotubes |
Larry E. Mosley, Yuegang Zhang |
2006-10-24 |
$13,658,000 |
| 7084495 |
Electroosmotic pumps using porous frits for cooling integrated circuit stacks |
Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers |
2006-08-01 |
$14,842,000 |
| 7078788 |
Microelectronic substrates with integrated devices |
Jian Li, Steven Towle |
2006-07-18 |
$11,508,000 |
| 7071024 |
Method for packaging a microelectronic device using on-die bond pad expansion |
Steven Towle, Martha Jones |
2006-07-04 |
|
| 6992381 |
Using external radiators with electroosmotic pumps for cooling integrated circuits |
Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Ravi Prasher +2 more |
2006-01-31 |
$19,938,000 |
| 6981849 |
Electro-osmotic pumps and micro-channels |
Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Ravi Prasher +1 more |
2006-01-03 |
$22,757,000 |
| 6964889 |
Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby |
Qing Ma, Xiao-Chun Mu |
2005-11-15 |
$35,574,000 |
| 6902950 |
Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby |
Qing Ma, Xiao-Chun Mu |
2005-06-07 |
$27,808,000 |
| 6894399 |
Microelectronic device having signal distribution functionality on an interfacial layer thereof |
Tuy T. Ton, Steven Towle |
2005-05-17 |
$25,995,000 |
| 6861274 |
Method of making a SDI electroosmotic pump using nanoporous dielectric frit |
R. Scott List, Alan M. Myers |
2005-03-01 |
$28,008,000 |
| 6825063 |
Integrated core microelectronic package |
Jian Li, Qing Ma, Maria V. Henao, Chun Mu |
2004-11-30 |
$36,984,000 |
| 6790704 |
Method for capacitively coupling electronic devices |
Brian S. Doyle, David B. Fraser |
2004-09-14 |
$15,917,000 |
| 6737754 |
COF packaged semiconductor |
Qing Ma, Jin Lee, Chun Mu, Jian Li, Larry E. Mosley |
2004-05-18 |
$30,392,000 |
| 6734534 |
Microelectronic substrate with integrated devices |
Jian Li, Steven Towle |
2004-05-11 |
$33,328,000 |
| 6656822 |
Method for reduced capacitance interconnect system using gaseous implants into the ILD |
Brian S. Doyle, Brian Roberds, Sandy Lee |
2003-12-02 |
$54,763,000 |
| 6586822 |
Integrated core microelectronic package |
Jian Li, Qing Ma, Maria V. Henao, Xiao-Chun Mu |
2003-07-01 |
$52,453,000 |
| 6586836 |
Process for forming microelectronic packages and intermediate structures formed therewith |
Qing Ma, Xiao-Chun Mu, Steve Towle |
2003-07-01 |
$52,453,000 |
| 6423570 |
Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby |
Qing Ma, Xiao-Chun Mu |
2002-07-23 |
$72,932,000 |
| 6388328 |
Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system |
Brian S. Doyle, Leopold Yau |
2002-05-14 |
$103,624,000 |
