Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7723208 | Integrated re-combiner for electroosmotic pumps using porous frits | Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers | 2010-05-25 |
| 7696015 | Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips | Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers | 2010-04-13 |
| 7667319 | Electroosmotic pump using nanoporous dielectric frit | R. Scott List, Alan M. Myers | 2010-02-23 |
| 7576432 | Using external radiators with electroosmotic pumps for cooling integrated circuits | Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Ravi Prasher +2 more | 2009-08-18 |
| 7274106 | Packaged electroosmotic pumps using porous frits for cooling integrated circuits | Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers | 2007-09-25 |
| 7189596 | Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structures | Chun Mu, Qing Ma, Steven Towle | 2007-03-13 |
| 7126207 | Capacitor with carbon nanotubes | Larry E. Mosley, Yuegang Zhang | 2006-10-24 |
| 7084495 | Electroosmotic pumps using porous frits for cooling integrated circuit stacks | Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers | 2006-08-01 |
| 7078788 | Microelectronic substrates with integrated devices | Jian Li, Steven Towle | 2006-07-18 |
| 7071024 | Method for packaging a microelectronic device using on-die bond pad expansion | Steven Towle, Martha Jones | 2006-07-04 |
| 6992381 | Using external radiators with electroosmotic pumps for cooling integrated circuits | Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Ravi Prasher +2 more | 2006-01-31 |
| 6981849 | Electro-osmotic pumps and micro-channels | Sarah Kim, R. Scott List, James G. Maveety, Alan M. Myers, Ravi Prasher +1 more | 2006-01-03 |
| 6964889 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Qing Ma, Xiao-Chun Mu | 2005-11-15 |
| 6902950 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Qing Ma, Xiao-Chun Mu | 2005-06-07 |
| 6894399 | Microelectronic device having signal distribution functionality on an interfacial layer thereof | Tuy T. Ton, Steven Towle | 2005-05-17 |
| 6861274 | Method of making a SDI electroosmotic pump using nanoporous dielectric frit | R. Scott List, Alan M. Myers | 2005-03-01 |
| 6825063 | Integrated core microelectronic package | Jian Li, Qing Ma, Maria V. Henao, Chun Mu | 2004-11-30 |
| 6790704 | Method for capacitively coupling electronic devices | Brian S. Doyle, David B. Fraser | 2004-09-14 |
| 6737754 | COF packaged semiconductor | Qing Ma, Jin Lee, Chun Mu, Jian Li, Larry E. Mosley | 2004-05-18 |
| 6734534 | Microelectronic substrate with integrated devices | Jian Li, Steven Towle | 2004-05-11 |
| 6656822 | Method for reduced capacitance interconnect system using gaseous implants into the ILD | Brian S. Doyle, Brian Roberds, Sandy Lee | 2003-12-02 |
| 6586822 | Integrated core microelectronic package | Jian Li, Qing Ma, Maria V. Henao, Xiao-Chun Mu | 2003-07-01 |
| 6586836 | Process for forming microelectronic packages and intermediate structures formed therewith | Qing Ma, Xiao-Chun Mu, Steve Towle | 2003-07-01 |
| 6423570 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Qing Ma, Xiao-Chun Mu | 2002-07-23 |
| 6388328 | Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system | Brian S. Doyle, Leopold Yau | 2002-05-14 |