LY

Leopold Yau

IN Intel: 1 patents #18,218 of 30,777Top 60%
Overall (All Time): #3,544,523 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6388328 Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system Brian S. Doyle, Quat Vu 2002-05-14