LY

Leopold Yau

IN Intel: 1 patents #18,218 of 30,777Top 60%
📍 Portland, OR: #6,022 of 9,213 inventorsTop 70%
🗺 Oregon: #17,068 of 28,073 inventorsTop 65%
Overall (All Time): #3,544,523 of 4,157,543Top 90%
1
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Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6388328 Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system Brian S. Doyle, Quat Vu 2002-05-14