Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby

Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby

US Patent 6423570 · Granted Jul 23, 2002

Estimated economic value: $72,932,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Massager2025
Massager2025
Application interface update method, apparatus and system2020
Semiconductor package with air pressure sensor2019
Package MEMS switch and method2019
Method of making an accelerometer2018
Method of making glass core substrate for integrated circuit devices2018
Microelectronic structures having laminated or embedded glass routing structures2018
Glass clad microelectronic substrate2017
Substrate for integrated circuit devices including multi-layer glass core and me2017
Package MEMS switch and method2017
Glass core substrate for integrated circuit devices and methods of making the sa2017