Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7078240 | Reliable adhesion layer interface structure for polymer memory electrode and method of making same | Jian Li | 2006-07-18 |
| 7018853 | Stepped structure for a multi-rank, stacked polymer memory device and method of making same | Jian Li | 2006-03-28 |
| 6964889 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Qing Ma, Quat Vu | 2005-11-15 |
| 6960479 | Stacked ferroelectric memory device and method of making same | Jian Li | 2005-11-01 |
| 6952017 | Low-voltage and interface damage-free polymer memory device | Jian Li, Mark Isenberger | 2005-10-04 |
| 6902950 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Qing Ma, Quat Vu | 2005-06-07 |
| 6858862 | Discrete polymer memory array and method of making same | Jian Li | 2005-02-22 |
| 6798003 | Reliable adhesion layer interface structure for polymer memory electrode and method of making same | Jian Li | 2004-09-28 |
| 6756620 | Low-voltage and interface damage-free polymer memory device | Jian Li, Mark Isenberger | 2004-06-29 |
| 6624457 | Stepped structure for a multi-rank, stacked polymer memory device and method of making same | Jian Li | 2003-09-23 |
| 6600364 | Active interposer technology for high performance CMOS packaging application | Chunlin Liang | 2003-07-29 |
| 6586822 | Integrated core microelectronic package | Quat Vu, Jian Li, Qing Ma, Maria V. Henao | 2003-07-01 |
| 6586836 | Process for forming microelectronic packages and intermediate structures formed therewith | Qing Ma, Quat Vu, Steve Towle | 2003-07-01 |
| 6524887 | Embedded recess in polymer memory package and method of making same | Jian Li | 2003-02-25 |
| 6461954 | Method and an apparatus for forming an under bump metallization structure | Jian Li, Sridhar Balakrishnan | 2002-10-08 |
| 6461895 | Process for making active interposer for high performance packaging applications | Chunlin Liang, Larry E. Mosley | 2002-10-08 |
| 6423570 | Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby | Qing Ma, Quat Vu | 2002-07-23 |
| 6365962 | Flip-chip on flex for high performance packaging applications | Chunlin Liang, Larry E. Mosley | 2002-04-02 |
| 6312830 | Method and an apparatus for forming an under bump metallization structure | Jian Li, Sridhar Balakrishnan | 2001-11-06 |
| 5792522 | High density plasma physical vapor deposition | Shu Jin, Xing Chen, Lawrence P. Bourget | 1998-08-11 |
| 5612254 | Methods of forming an interconnect on a semiconductor substrate | Srinivasan Sivaram, Donald S. Gardner, David B. Fraser | 1997-03-18 |
| 5350484 | Method for the anisotropic etching of metal films in the fabrication of interconnects | Donald S. Gardner, David B. Fraser | 1994-09-27 |
| 5343524 | Intelligent security device | Kai J. Chin, Feiying Chen | 1994-08-30 |
| 5167760 | Etchback process for tungsten contact/via filling | Jagir S. Multani | 1992-12-01 |
| 5035768 | Novel etch back process for tungsten contact/via filling | Jagir S. Multani | 1991-07-30 |