| 7759774 |
Shielded structures to protect semiconductor devices |
Brian S. Doyle |
2010-07-20 |
$9,455,000 |
| 6998357 |
High dielectric constant metal oxide gate dielectrics |
Gang Bai, Brian S. Doyle, Peng Cheng, Chunlin Liang |
2006-02-14 |
$11,997,000 |
| 6949831 |
In-plane on-chip decoupling capacitors and method for making same |
Chien Chiang |
2005-09-27 |
$20,905,000 |
| 6949476 |
Method of creating shielded structures to protect semiconductor devices |
Brian S. Doyle |
2005-09-27 |
$20,905,000 |
| 6790704 |
Method for capacitively coupling electronic devices |
Brian S. Doyle, Quat Vu |
2004-09-14 |
$15,917,000 |
| 6777320 |
In-plane on-chip decoupling capacitors and method for making same |
Chien Chiang |
2004-08-17 |
$19,443,000 |
| 6709885 |
Method of fabricating image sensors using a thin film photodiode above active CMOS circuitry |
Jack S. Uppal, Stephen Bradford Gospe, Kevin M. Connolly |
2004-03-23 |
$37,745,000 |
| 6696369 |
Method of creating shielded structures to protect semiconductor devices |
Brian S. Doyle |
2004-02-24 |
|
| 6689702 |
High dielectric constant metal oxide gate dielectrics |
Gang Bai, Brian S. Doyle, Peng Cheng, Chunlin Liang |
2004-02-10 |
$45,568,000 |
| 6528856 |
High dielectric constant metal oxide gate dielectrics |
Gang Bai, Brian S. Doyle, Peng Cheng, Chunlin Liang |
2003-03-04 |
$41,105,000 |
| 6501065 |
Image sensor using a thin film photodiode above active CMOS circuitry |
Jack S. Uppal, Stephen Bradford Gospe, Kevin M. Connolly |
2002-12-31 |
$37,060,000 |
| 6400015 |
Method of creating shielded structures to protect semiconductor devices |
Brian S. Doyle |
2002-06-04 |
$75,138,000 |
| 6309956 |
Fabricating low K dielectric interconnect systems by using dummy structures to enhance process |
Chien Chiang, Anne S. Mack, Jin Lee, Sing-Mo Tzeng, Chuanbin Pan +3 more |
2001-10-30 |
$145,735,000 |
| 6310400 |
Apparatus for capacitively coupling electronic devices |
Brian S. Doyle, Quat Vu |
2001-10-30 |
$145,735,000 |
| 6303464 |
Method and structure for reducing interconnect system capacitance through enclosed voids in a dielectric layer |
Eng T. Gaw, Quat Vu, Chien Chiang, Ian A. Young, Thomas Marieb |
2001-10-16 |
$231,350,000 |
| 6239019 |
Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectrics |
Chien Chiang |
2001-05-29 |
$200,835,000 |
| 6040628 |
Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectrics |
Chien Chiang |
2000-03-21 |
$323,907,000 |
| 6037249 |
Method for forming air gaps for advanced interconnect systems |
Chien Chiang, Vicky Ochoa, Chuanbin Pan, Sing-Mo Tzeng |
2000-03-14 |
$200,527,000 |
| 6027995 |
Method for fabricating an interconnect structure with hard mask and low dielectric constant materials |
Chien Chiang, Chuanbin Pan, Vicky Ochoa, Sychyi Fang, Joyce C. Sum +2 more |
2000-02-22 |
$388,032,000 |
| 5977634 |
Diffusion barrier for electrical interconnects in an integrated circuit |
Gang Bai |
1999-11-02 |
$87,065,000 |
| 5886410 |
Interconnect structure with hard mask and low dielectric constant materials |
Chien Chiang, Chuanbin Pan, Vicky Ochoa, Sychyi Fang, Joyce C. Sum +2 more |
1999-03-23 |
$273,463,000 |
| 5880030 |
Unlanded via structure and method for making same |
Sychyi Fang, Chien Chiang |
1999-03-09 |
$50,648,000 |
| 5861340 |
Method of forming a polycide film |
Gang Bai |
1999-01-19 |
$152,384,000 |
| 5858843 |
Low temperature method of forming gate electrode and gate dielectric |
Brian S. Doyle |
1999-01-12 |
$79,273,000 |
| 5817572 |
Method for forming multileves interconnections for semiconductor fabrication |
Chien Chiang |
1998-10-06 |
$51,460,000 |
