DF

David B. Fraser

IN Intel: 34 patents #1,045 of 30,777Top 4%
BL Bell Telephone Laboratories: 5 patents #75 of 1,445Top 6%
Overall (All Time): #76,971 of 4,157,543Top 2%
41
Patents All Time

Issued Patents All Time

Showing 25 most recent of 41 patents

Patent #TitleCo-InventorsDate
7759774 Shielded structures to protect semiconductor devices Brian S. Doyle 2010-07-20
6998357 High dielectric constant metal oxide gate dielectrics Gang Bai, Brian S. Doyle, Peng Cheng, Chunlin Liang 2006-02-14
6949831 In-plane on-chip decoupling capacitors and method for making same Chien Chiang 2005-09-27
6949476 Method of creating shielded structures to protect semiconductor devices Brian S. Doyle 2005-09-27
6790704 Method for capacitively coupling electronic devices Brian S. Doyle, Quat Vu 2004-09-14
6777320 In-plane on-chip decoupling capacitors and method for making same Chien Chiang 2004-08-17
6709885 Method of fabricating image sensors using a thin film photodiode above active CMOS circuitry Jack S. Uppal, Stephen Bradford Gospe, Kevin M. Connolly 2004-03-23
6696369 Method of creating shielded structures to protect semiconductor devices Brian S. Doyle 2004-02-24
6689702 High dielectric constant metal oxide gate dielectrics Gang Bai, Brian S. Doyle, Peng Cheng, Chunlin Liang 2004-02-10
6528856 High dielectric constant metal oxide gate dielectrics Gang Bai, Brian S. Doyle, Peng Cheng, Chunlin Liang 2003-03-04
6501065 Image sensor using a thin film photodiode above active CMOS circuitry Jack S. Uppal, Stephen Bradford Gospe, Kevin M. Connolly 2002-12-31
6400015 Method of creating shielded structures to protect semiconductor devices Brian S. Doyle 2002-06-04
6309956 Fabricating low K dielectric interconnect systems by using dummy structures to enhance process Chien Chiang, Anne S. Mack, Jin Lee, Sing-Mo Tzeng, Chuanbin Pan +3 more 2001-10-30
6310400 Apparatus for capacitively coupling electronic devices Brian S. Doyle, Quat Vu 2001-10-30
6303464 Method and structure for reducing interconnect system capacitance through enclosed voids in a dielectric layer Eng T. Gaw, Quat Vu, Chien Chiang, Ian A. Young, Thomas Marieb 2001-10-16
6239019 Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectrics Chien Chiang 2001-05-29
6040628 Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectrics Chien Chiang 2000-03-21
6037249 Method for forming air gaps for advanced interconnect systems Chien Chiang, Vicky Ochoa, Chuanbin Pan, Sing-Mo Tzeng 2000-03-14
6027995 Method for fabricating an interconnect structure with hard mask and low dielectric constant materials Chien Chiang, Chuanbin Pan, Vicky Ochoa, Sychyi Fang, Joyce C. Sum +2 more 2000-02-22
5977634 Diffusion barrier for electrical interconnects in an integrated circuit Gang Bai 1999-11-02
5886410 Interconnect structure with hard mask and low dielectric constant materials Chien Chiang, Chuanbin Pan, Vicky Ochoa, Sychyi Fang, Joyce C. Sum +2 more 1999-03-23
5880030 Unlanded via structure and method for making same Sychyi Fang, Chien Chiang 1999-03-09
5861340 Method of forming a polycide film Gang Bai 1999-01-19
5858843 Low temperature method of forming gate electrode and gate dielectric Brian S. Doyle 1999-01-12
5817572 Method for forming multileves interconnections for semiconductor fabrication Chien Chiang 1998-10-06