Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8258065 | Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same | Bomy Chen, Long Wang | 2012-09-04 |
| 7605092 | Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same | Bomy Chen, Long Wang | 2009-10-20 |
| 6309956 | Fabricating low K dielectric interconnect systems by using dummy structures to enhance process | Chien Chiang, David B. Fraser, Anne S. Mack, Jin Lee, Sing-Mo Tzeng +3 more | 2001-10-30 |
| 6027995 | Method for fabricating an interconnect structure with hard mask and low dielectric constant materials | Chien Chiang, Chuanbin Pan, Vicky Ochoa, David B. Fraser, Joyce C. Sum +2 more | 2000-02-22 |
| 5935868 | Interconnect structure and method to achieve unlanded vias for low dielectric constant materials | Chaunbin Pan, Sing-Mo Tzeng, Chien Chiang | 1999-08-10 |
| 5886410 | Interconnect structure with hard mask and low dielectric constant materials | Chien Chiang, Chuanbin Pan, Vicky Ochoa, David B. Fraser, Joyce C. Sum +2 more | 1999-03-23 |
| 5880030 | Unlanded via structure and method for making same | Chien Chiang, David B. Fraser | 1999-03-09 |