| 12424502 |
Integrated circuit package with heat transfer chimney including thermally conductive nanoparticles |
Justin Sato |
2025-09-23 |
|
| 12395179 |
Vapor cells and related systems and methods |
Robert Lutwak |
2025-08-19 |
|
| 12205910 |
Integrated circuit bond pad with multi-material toothed structure |
Justin Sato, Yaojian Leng, Gerald Marsico, Julius Kovats |
2025-01-21 |
|
| 12040282 |
Electronic device including interposers bonded to each other |
Justin Sato, Anu Ramamurthy, Julius Kovats |
2024-07-16 |
$156,500,000 |
| 11935824 |
Integrated circuit package module including a bonding system |
Justin Sato, Yaojian Leng, Julius Kovats |
2024-03-19 |
$50,408,000 |
| 11764796 |
Vapor cells and related systems and methods |
Robert Lutwak |
2023-09-19 |
$138,920,000 |
| 11723222 |
Integrated circuit (IC) package with integrated inductor having core magnetic field (B field) extending parallel to substrate |
Yaojian Leng, Justin Sato |
2023-08-08 |
$153,453,000 |
| 11682642 |
Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond |
Justin Sato, Andrew Taylor |
2023-06-20 |
$146,746,000 |
| 11682641 |
Integrated circuit bond pad with multi-material toothed structure |
Justin Sato, Yaojian Leng, Gerald Marsico, Julius Kovats |
2023-06-20 |
$146,746,000 |
| 11043471 |
Mixed-orientation multi-die integrated circuit package with at least one vertically-mounted die |
Justin Hiroki Sato |
2021-06-22 |
$291,132,000 |
| 10896888 |
Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond |
Justin Hiroki Sato, Andrew Taylor |
2021-01-19 |
$184,231,000 |
| 10861550 |
Flash memory cell adapted for low voltage and/or non-volatile performance |
Sonu Daryanani, Matthew Martin |
2020-12-08 |
$111,722,000 |
| 10700171 |
Non-volatile flash memory cell |
Sonu Daryanani, Mel Hymas |
2020-06-30 |
$75,955,000 |
| 10546947 |
Memory cell with oxide cap and spacer layer for protecting a floating gate from a source implant |
Mel Hymas, Greg Stom, James Walls |
2020-01-28 |
$72,935,000 |
| 10381330 |
Sacrificial alignment ring and self-soldering vias for wafer bonding |
Justin Hiroki Sato, Walter Lundy |
2019-08-13 |
|
| 10056545 |
Sidewall-type memory cell |
Justin Hiroki Sato, Sonu Daryanani |
2018-08-21 |
$121,173,000 |
| 9786779 |
High voltage double-diffused MOS (DMOS) device and method of manufacture |
Sonu Daryanani |
2017-10-10 |
$33,523,000 |
| 9601615 |
High voltage double-diffused MOS (DMOS) device and method of manufacture |
Sonu Daryanani |
2017-03-21 |
$18,549,000 |
| 9455037 |
EEPROM memory cell with low voltage read path and high voltage erase/write path |
Kent Hewitt, Jack T. Wong, Sonu Daryanani, Jeffrey A. Shields, Daniel A. Alvarez +1 more |
2016-09-27 |
$63,626,000 |
| 9444040 |
Sidewall type memory cell |
Justin Hiroki Sato, Sonu Daryanani |
2016-09-13 |
$62,245,000 |
| 9306055 |
High voltage double-diffused MOS (DMOS) device and method of manufacture |
Sonu Daryanani |
2016-04-05 |
$23,143,000 |
| 8846538 |
Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same |
Long Wang, Sychi Fang |
2014-09-30 |
|
| 8258065 |
Passive elements, articles, packages, semiconductor composites, and methods of manufacturing same |
Long Wang, Sychyi Fang |
2012-09-04 |
|
| 7800159 |
Array of contactless non-volatile memory cells |
Yuniarto Widjaja, Henry A. O'M'Mani, Prateep Tuntasood |
2010-09-21 |
|
| 7790518 |
Method of trimming semiconductor elements with electrical resistance feedback |
Ya-Fen Lin, Zhitang Song, Songlin Feng |
2010-09-07 |
|
