Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond

Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond

US Patent 10896888 · Granted Jan 19, 2021

Estimated economic value: $184,231,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit package with heat transfer chimney including thermally conduc2025
Vapor cells and related systems and methods2025
Integrated circuit bond pad with multi-material toothed structure2025
Electronic device including interposers bonded to each other2024
Integrated circuit package module including a bonding system2024
Vapor cells and related systems and methods2023
Integrated circuit (IC) package with integrated inductor having core magnetic fi2023
Integrated circuit bond pad with multi-material toothed structure2023
Integrated circuit (IC) device including a force mitigation system for reducing 2023
Integrated circuit (IC) device including a force mitigation system for reducing 2023
High strain tolerant chord-wise ice protection layout2022
Mixed-orientation multi-die integrated circuit package with at least one vertica2021