Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond

Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond

US Patent 11682642 · Granted Jun 20, 2023

Estimated economic value: $146,746,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated inductor with a stacked metal wire2025
Integrated circuit package with heat transfer chimney including thermally conduc2025
Integrated circuit package with heat transfer chimney including thermally conduc2025
Vapor cells and related systems and methods2025
Metal-oxide-metal (MOM) capacitors for integrated circuit monitoring2025
Integrated circuit bond pad with multi-material toothed structure2025
Integrated circuit bond pad with multi-material toothed structure2025
Electronic device including interposers bonded to each other2024
Electronic device including interposers bonded to each other2024
Integrated circuit package module including a bonding system2024
Integrated circuit package module including a bonding system2024
Vapor cells and related systems and methods2023