Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381330 | Sacrificial alignment ring and self-soldering vias for wafer bonding | Justin Hiroki Sato, Bomy Chen | 2019-08-13 |
| 8853091 | Method for manufacturing a semiconductor die with multiple depth shallow trench isolation | Justin Hiroki Sato, Brian Hennes, Greg Stom, Robert P. Ma | 2014-10-07 |