Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5935868 | Interconnect structure and method to achieve unlanded vias for low dielectric constant materials | Sychyi Fang, Sing-Mo Tzeng, Chien Chiang | 1999-08-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5935868 | Interconnect structure and method to achieve unlanded vias for low dielectric constant materials | Sychyi Fang, Sing-Mo Tzeng, Chien Chiang | 1999-08-10 |