Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6309956 | Fabricating low K dielectric interconnect systems by using dummy structures to enhance process | Chien Chiang, David B. Fraser, Anne S. Mack, Jin Lee, Chuanbin Pan +3 more | 2001-10-30 | $145,735,000 |
| 6037249 | Method for forming air gaps for advanced interconnect systems | Chien Chiang, David B. Fraser, Vicky Ochoa, Chuanbin Pan | 2000-03-14 | $200,527,000 |
| 5935868 | Interconnect structure and method to achieve unlanded vias for low dielectric constant materials | Sychyi Fang, Chaunbin Pan, Chien Chiang | 1999-08-10 | $109,908,000 |
| 5614444 | Method of using additives with silica-based slurries to enhance selectivity in metal CMP | János Farkas, Rahul Jairath, Matt Stell | 1997-03-25 |