RJ

Rahul Jairath

Lam Research: 10 patents #289 of 2,128Top 15%
NS National Semiconductor: 4 patents #498 of 2,238Top 25%
SE Sematech: 3 patents #13 of 123Top 15%
OS Ontrak Systems: 2 patents #12 of 45Top 30%
AT AT&T: 1 patents #10,626 of 18,772Top 60%
DE Digital Equipment: 1 patents #1,005 of 2,100Top 50%
IN Intel: 1 patents #18,218 of 30,777Top 60%
AL Accenture Global Solutions Limited: 1 patents #1,203 of 3,138Top 40%
🗺 Texas: #7,287 of 125,132 inventorsTop 6%
Overall (All Time): #237,558 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDate
10762524 Data platform and analytics for predicting media metrics Nicola Sarah Vanessa Poynter, Suchit Malhotra, Shaifali Panwar, Saurabh Kumar Singh, Julian Richard Taverner Smith 2020-09-01
6855239 Plating method and apparatus using contactless electrode 2005-02-15
6656025 Integrated pad and belt for chemical mechanical polishing Anil K. Pant, Kamal Mishra, Saket Chadda, Wilbur C. Krusell 2003-12-02
6621584 Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing Jiri Pecen, Saket Chadda, Wilbur C. Krusell 2003-09-16
6517418 Method of transporting a semiconductor wafer in a wafer polishing system Erik H. Engdahl, Edward T. Ferri, Jr., Wilbur C. Krusell 2003-02-11
6336845 Method and apparatus for polishing semiconductor wafers Erik H. Engdahl, Edward T. Ferri, Jr., Wilbur C. Krusell, Randall L. Green, Anil K. Pant 2002-01-08
6328642 Integrated pad and belt for chemical mechanical polishing Anil K. Pant, Kamal Mishra, Saket Chadda, Wilbur C. Krusell 2001-12-11
6261155 Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher Jiri Pecen, Saket Chadda, Wilbur C. Krusell, Jerauld J. Cutini, Erik H. Engdahl 2001-07-17
6146248 Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher Jiri Pecen, Saket Chadda, Wilbur C. Krusell, Jerauld J. Cutini, Erik H. Engdahl 2000-11-14
6111634 Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing Jiri Pecen, John Fielden, Saket Chadda, Lloyd J. LaComb, JR., Wilbur C. Krusell 2000-08-29
6108091 Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing Jiri Pecen, Saket Chadda, Wilbur C. Krusell 2000-08-22
5913714 Method for dressing a polishing pad during polishing of a semiconductor wafer Konstantin Volodarsky 1999-06-22
5866031 Slurry formulation for chemical mechanical polishing of metals Ronald A. Carpio, Jayashree Kalpathy-Cramer 1999-02-02
5857899 Wafer polishing head with pad dressing element Konstantin Volodarsky 1999-01-12
5762536 Sensors for a linear polisher Anil K. Pant, Joseph R. Breivogel, Douglas W. Young, Erik H. Engdahl 1998-06-09
5688360 Method and apparatus for polishing a semiconductor substrate wafer 1997-11-18
5665656 Method and apparatus for polishing a semiconductor substrate wafer 1997-09-09
5614444 Method of using additives with silica-based slurries to enhance selectivity in metal CMP János Farkas, Matt Stell, Sing-Mo Tzeng 1997-03-25
5478435 Point of use slurry dispensing system James J. Murphy, János Farkas, Lucia C. Markert 1995-12-26