Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6927198 | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film | Liming Zhang, Yuexing Zhao, Diane Hymes | 2005-08-09 |
| 6746320 | Linear reciprocating disposable belt polishing method and apparatus | Glenn W. Travis, Erik H. Engdahl, James Bagley | 2004-06-08 |
| 6656025 | Integrated pad and belt for chemical mechanical polishing | Anil K. Pant, Rahul Jairath, Kamal Mishra, Saket Chadda | 2003-12-02 |
| 6621584 | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing | Jiri Pecen, Saket Chadda, Rahul Jairath | 2003-09-16 |
| 6616772 | Methods for wafer proximity cleaning and drying | John M. de Larios, Mike Ravkin, Glen Travis, Jim Keller | 2003-09-09 |
| 6594847 | Single wafer residue, thin film removal and clean | John M. de Larios, Mike Ravkin | 2003-07-22 |
| 6517418 | Method of transporting a semiconductor wafer in a wafer polishing system | Erik H. Engdahl, Edward T. Ferri, Jr., Rahul Jairath | 2003-02-11 |
| 6500056 | Linear reciprocating disposable belt polishing method and apparatus | Glenn W. Travis, Erik H. Engdahl, James Bagley | 2002-12-31 |
| 6488040 | Capillary proximity heads for single wafer cleaning and drying | John M. de Larios, Mike Ravkin, Glen Travis, Jim Keller | 2002-12-03 |
| 6479443 | Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film | Liming Zhang, Yuexing Zhao, Diane Hymes | 2002-11-12 |
| 6428394 | Method and apparatus for chemical mechanical planarization and polishing of semiconductor wafers using a continuous polishing member feed | Ben Mooring, Glenn W. Travis, Erik H. Engdahl | 2002-08-06 |
| 6336845 | Method and apparatus for polishing semiconductor wafers | Erik H. Engdahl, Edward T. Ferri, Jr., Rahul Jairath, Randall L. Green, Anil K. Pant | 2002-01-08 |
| 6334229 | Apparatus for cleaning edges of contaminated substrates | Mansour Moinpour, Hoang T. Nguyen, Mohsen Salek, Young C. Park, Tom Bramblett +3 more | 2002-01-01 |
| 6328642 | Integrated pad and belt for chemical mechanical polishing | Anil K. Pant, Rahul Jairath, Kamal Mishra, Saket Chadda | 2001-12-11 |
| 6325706 | Use of zeta potential during chemical mechanical polishing for end point detection | Andrew J. Nagengast, Anil K. Pant | 2001-12-04 |
| 6274059 | Method to remove metals in a scrubber | Igor J. Malik | 2001-08-14 |
| 6261155 | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher | Rahul Jairath, Jiri Pecen, Saket Chadda, Jerauld J. Cutini, Erik H. Engdahl | 2001-07-17 |
| 6224461 | Method and apparatus for stabilizing the process temperature during chemical mechanical polishing | Robert G. Boehm, Jr., Anil K. Pant, Erik H. Engdahl | 2001-05-01 |
| 6186865 | Apparatus and method for performing end point detection on a linear planarization tool | Brian Thornton, Andrew J. Nagengast, Robert G. Boehm, Jr., Anil K. Pant | 2001-02-13 |
| 6165956 | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film | Liming Zhang, Yuexing Zhao, Diane Hymes | 2000-12-26 |
| 6162301 | Methods and apparatus for cleaning semiconductor substrates after polishing of copper film | Liming Zhang, Yuexing Zhao, Diane Hymes | 2000-12-19 |
| 6145148 | Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF) | Diane Hymes, Michael Ravkin, Xiuhua Zhang | 2000-11-14 |
| 6146248 | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher | Rahul Jairath, Jiri Pecen, Saket Chadda, Jerauld J. Cutini, Erik H. Engdahl | 2000-11-14 |
| 6111634 | Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing | Jiri Pecen, John Fielden, Saket Chadda, Lloyd J. LaComb, JR., Rahul Jairath | 2000-08-29 |
| 6108091 | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing | Jiri Pecen, Saket Chadda, Rahul Jairath | 2000-08-22 |