| 8187377 |
Non-contact etch annealing of strained layers |
Sien G. Kang, Martin Fuerfanger, Harry Kirk, Ariel Flat, Michael I. Current +1 more |
2012-05-29 |
| 7598153 |
Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species |
Francois J. Henley, James Sullivan, Sien G. Kang, Philip James Ong, Harry Kirk +1 more |
2009-10-06 |
| 7595499 |
Method and system for fabricating strained layers for the manufacture of integrated circuits |
Francois J. Henley, Philip James Ong, Harry Kirk |
2009-09-29 |
| 7391047 |
System for forming a strained layer of semiconductor material |
Francois J. Henley, Philip James Ong, Harry Kirk |
2008-06-24 |
| 7390724 |
Method and system for lattice space engineering |
Francois J. Henley, Philip James Ong |
2008-06-24 |
| 7253081 |
Surface finishing of SOI substrates using an EPI process |
Sien G. Kang |
2007-08-07 |
| 7147709 |
Non-contact etch annealing of strained layers |
Philip James Ong, Francois J. Henley |
2006-12-12 |
| 7094666 |
Method and system for fabricating strained layers for the manufacture of integrated circuits |
Francois J. Henley, Philip James Ong, Harry Kirk |
2006-08-22 |
| 6969668 |
Treatment method of film quality for the manufacture of substrates |
Sien G. Kang |
2005-11-29 |
| 6881644 |
Smoothing method for cleaved films made using a release layer |
Sien G. Kang |
2005-04-19 |
| 6455399 |
Smoothing method for cleaved films made using thermal treatment |
Sien G. Kang |
2002-09-24 |
| 6448152 |
Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customer |
Francois J. Henley, Sien G. Kang |
2002-09-10 |
| 6287941 |
Surface finishing of SOI substrates using an EPI process |
Sien G. Kang |
2001-09-11 |
| 6274059 |
Method to remove metals in a scrubber |
Wilbur C. Krusell |
2001-08-14 |
| 6265328 |
Wafer edge engineering method and device |
Francois J. Henley, Nathan W. Cheung, William G. Eng |
2001-07-24 |
| 6221774 |
Method for surface treatment of substrates |
— |
2001-04-24 |
| 6204151 |
Smoothing method for cleaved films made using thermal treatment |
Sien G. Kang |
2001-03-20 |
| 6171965 |
Treatment method of cleaved film for the manufacture of substrates |
Sien G. Kang |
2001-01-09 |
| 5919311 |
Control of SiO.sub.2 etch rate using dilute chemical etchants in the presence of a megasonic field |
Larry W. Shive |
1999-07-06 |
