| 8241996 |
Substrate stiffness method and resulting devices for layer transfer process |
Francois J. Henley, James Sullivan |
2012-08-14 |
| 8187377 |
Non-contact etch annealing of strained layers |
Igor J. Malik, Sien G. Kang, Martin Fuerfanger, Ariel Flat, Michael I. Current +1 more |
2012-05-29 |
| 7910456 |
Liquid based substrate method and structure for layer transfer applications |
— |
2011-03-22 |
| 7811901 |
Method and edge region structure using co-implanted particles for layer transfer processes |
Philip James Ong, James Sullivan |
2010-10-12 |
| 7772088 |
Method for manufacturing devices on a multi-layered substrate utilizing a stiffening backing substrate |
Francois J. Henley, James Sullivan |
2010-08-10 |
| 7598153 |
Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species |
Francois J. Henley, James Sullivan, Sien G. Kang, Philip James Ong, David Jacy +1 more |
2009-10-06 |
| 7595499 |
Method and system for fabricating strained layers for the manufacture of integrated circuits |
Francois J. Henley, Philip James Ong, Igor J. Malik |
2009-09-29 |
| 7479441 |
Method and apparatus for flag-less water bonding tool |
Francois J. Henley, Philip James Ong |
2009-01-20 |
| 7427554 |
Manufacturing strained silicon substrates using a backing material |
Francois J. Henley |
2008-09-23 |
| 7391047 |
System for forming a strained layer of semiconductor material |
Francois J. Henley, Philip James Ong, Igor J. Malik |
2008-06-24 |
| 7094666 |
Method and system for fabricating strained layers for the manufacture of integrated circuits |
Francois J. Henley, Philip James Ong, Igor J. Malik |
2006-08-22 |