Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10164144 | Bond and release layer transfer process | Francois J. Henley, Mingyu ZHONG, Minghang LI | 2018-12-25 |
| 10041187 | Techniques for forming optoelectronic devices | Francois J. Henley, Albert Lamm | 2018-08-07 |
| 9859458 | Bond and release layer transfer process | Francois J. Henley, Mingyu ZHONG, Minghang LI | 2018-01-02 |
| 9257339 | Techniques for forming optoelectronic devices | Francois J. Henley, Albert Lamm | 2016-02-09 |
| 8187377 | Non-contact etch annealing of strained layers | Igor J. Malik, Martin Fuerfanger, Harry Kirk, Ariel Flat, Michael I. Current +1 more | 2012-05-29 |
| 8133800 | Free-standing thickness of single crystal material and method having carrier lifetimes | Francois J. Henley, Zuqin Liu, Lu Tian | 2012-03-13 |
| 7598153 | Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species | Francois J. Henley, James Sullivan, Philip James Ong, Harry Kirk, David Jacy +1 more | 2009-10-06 |
| 7253081 | Surface finishing of SOI substrates using an EPI process | Igor J. Malik | 2007-08-07 |
| 6969668 | Treatment method of film quality for the manufacture of substrates | Igor J. Malik | 2005-11-29 |
| 6881644 | Smoothing method for cleaved films made using a release layer | Igor J. Malik | 2005-04-19 |
| 6455399 | Smoothing method for cleaved films made using thermal treatment | Igor J. Malik | 2002-09-24 |
| 6448152 | Method and system for generating a plurality of donor wafers and handle wafers prior to an order being placed by a customer | Francois J. Henley, Igor J. Malik | 2002-09-10 |
| 6287941 | Surface finishing of SOI substrates using an EPI process | Igor J. Malik | 2001-09-11 |
| 6204151 | Smoothing method for cleaved films made using thermal treatment | Igor J. Malik | 2001-03-20 |
| 6171965 | Treatment method of cleaved film for the manufacture of substrates | Igor J. Malik | 2001-01-09 |
| 6130159 | Apparatus and methods for minimizing as-deposited stress in tungsten silicide films | John Y. Adachi, David Badt, Edward L. Sill, Hector Velasco | 2000-10-10 |
| 5963836 | Methods for minimizing as-deposited stress in tungsten silicide films | John Y. Adachi, David Badt, Edward L. Sill, Hector Velasco | 1999-10-05 |
| 5447570 | Purge gas in wafer coating area selection | Johannes Schmitz, Frederick J. Scholz, Norman L. Turner, Raymond L. Chow, Frank O. Uher +1 more | 1995-09-05 |
| 5387289 | Film uniformity by selective pressure gradient control | Johannes Schmitz, Raymond L. Chow, Edward J. Rode, Frank O. Uher | 1995-02-07 |
| 5272112 | Low-temperature low-stress blanket tungsten film | Johannes Schmitz, Edward J. Rode | 1993-12-21 |