Issued Patents All Time
Showing 1–25 of 151 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444221 | Layer transfer of films utilizing controlled shear region | — | 2022-09-13 |
| 11380816 | Light emitting diode (LED) mass-transfer apparatus and method of manufacture | — | 2022-07-05 |
| 11037841 | Light emitting diode (LED) test apparatus and method of manufacture | — | 2021-06-15 |
| 10989755 | Light emitting diode (LED) test apparatus and method of manufacture | — | 2021-04-27 |
| 10978429 | Light emitting diode (LED) mass-transfer apparatus and method of manufacture | — | 2021-04-13 |
| 10962586 | Light emitting diode (LED) test apparatus and method of manufacture | — | 2021-03-30 |
| 10683588 | Shaped silicon ingot using layer transfer | — | 2020-06-16 |
| 10600697 | Light emitting diode (LED) test apparatus and method of manufacture | — | 2020-03-24 |
| 10186630 | Seed wafer for GaN thickening using gas- or liquid-phase epitaxy | — | 2019-01-22 |
| 10164144 | Bond and release layer transfer process | Sien G. Kang, Mingyu ZHONG, Minghang LI | 2018-12-25 |
| 10087551 | Method and device for slicing a shaped silicon ingot using layer transfer | — | 2018-10-02 |
| 10041187 | Techniques for forming optoelectronic devices | Sien G. Kang, Albert Lamm | 2018-08-07 |
| 9859458 | Bond and release layer transfer process | Sien G. Kang, Mingyu ZHONG, Minghang LI | 2018-01-02 |
| 9640711 | Substrate cleaving under controlled stress conditions | Al Lamm, Yi-Lei Chow | 2017-05-02 |
| 9460908 | Method and device for slicing a shaped silicon ingot using layer transfer | — | 2016-10-04 |
| 9362439 | Layer transfer of films utilizing controlled shear region | — | 2016-06-07 |
| 9356181 | Substrate cleaving under controlled stress conditions | Al Lamm, Yi-Lei Chow | 2016-05-31 |
| 9336989 | Method of cleaving a thin sapphire layer from a bulk material by implanting a plurality of particles and performing a controlled cleaving process | — | 2016-05-10 |
| 9257339 | Techniques for forming optoelectronic devices | Sien G. Kang, Albert Lamm | 2016-02-09 |
| 9159605 | Controlled process and resulting device | Nathan W. Cheung | 2015-10-13 |
| 8993410 | Substrate cleaving under controlled stress conditions | Al Lamm, Yi-Lei Chow | 2015-03-31 |
| 8835282 | Controlled process and resulting device | Nathan W. Cheung | 2014-09-16 |
| 8637382 | Layer transfer of films utilizing thermal flux regime for energy controlled cleaving | — | 2014-01-28 |
| 8623137 | Method and device for slicing a shaped silicon ingot using layer transfer | — | 2014-01-07 |
| 8563402 | Method and structure for fabricating solar cells using a thick layer transfer process | — | 2013-10-22 |