Issued Patents All Time
Showing 51–75 of 151 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7629666 | Method and structure for implanting bonded substrates for electrical conductivity | — | 2009-12-08 |
| 7598153 | Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species | James Sullivan, Sien G. Kang, Philip James Ong, Harry Kirk, David Jacy +1 more | 2009-10-06 |
| 7595499 | Method and system for fabricating strained layers for the manufacture of integrated circuits | Philip James Ong, Igor J. Malik, Harry Kirk | 2009-09-29 |
| 7547609 | Method and structure for implanting bonded substrates for electrical conductivity | — | 2009-06-16 |
| 7479441 | Method and apparatus for flag-less water bonding tool | Harry Kirk, Philip James Ong | 2009-01-20 |
| 7470600 | Method and device for controlled cleaving process | Nathan W. Cheung | 2008-12-30 |
| 7462526 | Method for fabricating semiconductor devices using strained silicon bearing material | — | 2008-12-09 |
| 7427554 | Manufacturing strained silicon substrates using a backing material | Harry Kirk | 2008-09-23 |
| 7410887 | Controlled process and resulting device | Nathan W. Cheung | 2008-08-12 |
| 7399680 | Method and structure for implanting bonded substrates for electrical conductivity | — | 2008-07-15 |
| 7391047 | System for forming a strained layer of semiconductor material | Philip James Ong, Igor J. Malik, Harry Kirk | 2008-06-24 |
| 7390724 | Method and system for lattice space engineering | Philip James Ong, Igor J. Malik | 2008-06-24 |
| 7378330 | Cleaving process to fabricate multilayered substrates using low implantation doses | Michael A. Bryan, William G. En | 2008-05-27 |
| 7371660 | Controlled cleaving process | Nathan W. Cheung | 2008-05-13 |
| 7354815 | Method for fabricating semiconductor devices using strained silicon bearing material | — | 2008-04-08 |
| 7351644 | Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process | — | 2008-04-01 |
| 7348258 | Method and device for controlled cleaving process | Nathan W. Cheung | 2008-03-25 |
| 7166520 | Thin handle substrate method and structure for fabricating devices using one or more films provided by a layer transfer process | — | 2007-01-23 |
| 7160790 | Controlled cleaving process | Nathan W. Cheung | 2007-01-09 |
| 7147709 | Non-contact etch annealing of strained layers | Philip James Ong, Igor J. Malik | 2006-12-12 |
| 7094666 | Method and system for fabricating strained layers for the manufacture of integrated circuits | Philip James Ong, Igor J. Malik, Harry Kirk | 2006-08-22 |
| 7078317 | Method and system for source switching and in-situ plasma bonding | — | 2006-07-18 |
| 7056808 | Cleaving process to fabricate multilayered substrates using low implantation doses | Michael A. Bryan, William G. En | 2006-06-06 |
| 6890838 | Gettering technique for wafers made using a controlled cleaving process | Nathan W. Cheung | 2005-05-10 |
| 6790747 | Method and device for controlled cleaving process | Nathan W. Cheung | 2004-09-14 |