AP

Anil K. Pant

Lam Research: 12 patents #236 of 2,128Top 15%
OS Ontrak Systems: 1 patents #28 of 45Top 65%
📍 Santa Cruz, CA: #232 of 1,911 inventorsTop 15%
🗺 California: #37,514 of 386,348 inventorsTop 10%
Overall (All Time): #302,050 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Showing 1–16 of 16 patents

Patent #TitleCo-InventorsDate
6905526 Fabrication of an ion exchange polish pad Sanjay Dabral 2005-06-14
6773337 Method and apparatus to recondition an ion exchange polish pad Sanjay Dabral 2004-08-10
6722950 Method and apparatus for electrodialytic chemical mechanical polishing and deposition Sanjay Dabral 2004-04-20
6656025 Integrated pad and belt for chemical mechanical polishing Rahul Jairath, Kamal Mishra, Saket Chadda, Wilbur C. Krusell 2003-12-02
6425812 Polishing head for chemical mechanical polishing using linear planarization technology Douglas W. Young, Glenn W. Travis, Konstantin Volodarsky, Andrew J. Nagengast 2002-07-30
6416385 Method and apparatus for polishing semiconductor wafers Edward T. Ferri, Jr., Randall L. Green 2002-07-09
6336845 Method and apparatus for polishing semiconductor wafers Erik H. Engdahl, Edward T. Ferri, Jr., Wilbur C. Krusell, Rahul Jairath, Randall L. Green 2002-01-08
6328642 Integrated pad and belt for chemical mechanical polishing Rahul Jairath, Kamal Mishra, Saket Chadda, Wilbur C. Krusell 2001-12-11
6325706 Use of zeta potential during chemical mechanical polishing for end point detection Wilbur C. Krusell, Andrew J. Nagengast 2001-12-04
6224461 Method and apparatus for stabilizing the process temperature during chemical mechanical polishing Robert G. Boehm, Jr., Wilbur C. Krusell, Erik H. Engdahl 2001-05-01
6186865 Apparatus and method for performing end point detection on a linear planarization tool Brian Thornton, Andrew J. Nagengast, Robert G. Boehm, Jr., Wilbur C. Krusell 2001-02-13
6132289 Apparatus and method for film thickness measurement integrated into a wafer load/unload unit Michael Labunsky, Andrew J. Nagengast 2000-10-17
5916012 Control of chemical-mechanical polishing rate across a substrate surface for a linear polisher Joseph R. Breivogel, Douglas W. Young, Robert M. Rivera 1999-06-29
5871390 Method and apparatus for aligning and tensioning a pad/belt used in linear planarization for chemical mechanical polishing Douglas W. Young, Joseph R. Breivogel, Konstantin Volodarski, Leon Volfovski 1999-02-16
5800248 Control of chemical-mechanical polishing rate across a substrate surface Douglas W. Young, Anthony Meyer, Konstantin Volodarsky, David E. Weldon 1998-09-01
5762536 Sensors for a linear polisher Joseph R. Breivogel, Douglas W. Young, Rahul Jairath, Erik H. Engdahl 1998-06-09