Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6328637 | Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization | Tac Huynh, Anthony Meyer, Andrew J. Nagengast, Glenn W. Travis | 2001-12-11 |
| 6132289 | Apparatus and method for film thickness measurement integrated into a wafer load/unload unit | Andrew J. Nagengast, Anil K. Pant | 2000-10-17 |
| 6086460 | Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization | Tac Huynh, Anthony Meyer, Andrew J. Nagengast, Glenn W. Travis | 2000-07-11 |