Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6309956 | Fabricating low K dielectric interconnect systems by using dummy structures to enhance process | Chien Chiang, David B. Fraser, Anne S. Mack, Jin Lee, Sing-Mo Tzeng +3 more | 2001-10-30 | $145,735,000 |
| 6037249 | Method for forming air gaps for advanced interconnect systems | Chien Chiang, David B. Fraser, Chuanbin Pan, Sing-Mo Tzeng | 2000-03-14 | $200,527,000 |
| 6027995 | Method for fabricating an interconnect structure with hard mask and low dielectric constant materials | Chien Chiang, Chuanbin Pan, Sychyi Fang, David B. Fraser, Joyce C. Sum +2 more | 2000-02-22 | $388,032,000 |
| 5886410 | Interconnect structure with hard mask and low dielectric constant materials | Chien Chiang, Chuanbin Pan, Sychyi Fang, David B. Fraser, Joyce C. Sum +2 more | 1999-03-23 | $273,463,000 |