Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6309956 | Fabricating low K dielectric interconnect systems by using dummy structures to enhance process | Chien Chiang, David B. Fraser, Anne S. Mack, Jin Lee, Sing-Mo Tzeng +3 more | 2001-10-30 |
| 6037249 | Method for forming air gaps for advanced interconnect systems | Chien Chiang, David B. Fraser, Chuanbin Pan, Sing-Mo Tzeng | 2000-03-14 |
| 6027995 | Method for fabricating an interconnect structure with hard mask and low dielectric constant materials | Chien Chiang, Chuanbin Pan, Sychyi Fang, David B. Fraser, Joyce C. Sum +2 more | 2000-02-22 |
| 5886410 | Interconnect structure with hard mask and low dielectric constant materials | Chien Chiang, Chuanbin Pan, Sychyi Fang, David B. Fraser, Joyce C. Sum +2 more | 1999-03-23 |