Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Chien Chiang — 31 Patents

Intel: 28 patents #1,370 of 30,777Top 5%
ESEtherwan Systems: 1 patents #3 of 5Top 60%
MEMediatek: 1 patents #1,722 of 2,888Top 60%
OVOvonyx: 1 patents #64 of 96Top 70%
Fremont, CA: #492 of 9,298 inventorsTop 6%
California: #16,606 of 386,348 inventorsTop 5%
Overall (All Time): #115,823 of 4,157,543Top 3%
31 Patents All Time
Chien Chiang has been granted 31 US patents while listed as an inventor at Intel. The first was granted in 1998 and the most recent in October 2021. Chien Chiang ranks #115,823 of 4,157,543 US inventors in our database (top 2.8%). Patent records list Chien Chiang in Fremont, CA, US.

Patents per Year

Patents granted per year, 1998 to 2021Bar chart with a peak of 5 patents in 2000.peak 51998: 2 patents19981999: 3 patents2000: 5 patents20002001: 4 patents2002: 1 patents20022003: 3 patents2004: 3 patents20042005: 3 patents2006: 1 patents20062007: 4 patents2013: 1 patents20132021: 1 patents2021

Issued Patents All Time

Showing 1–25 of 31 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
11138037 Switch policy for hybrid scheduling in multi-processor systems Ya-Ting Chang, Ting-Chang Huang, Jing Wu, Jia-Ming Chen 2021-10-05
8369342 System, apparatus, and method for extending network with power supply 2013-02-05
7217945 Method to selectively increase the top resistance of the lower programming electrode in a phase-change memory cell and structures obtained thereby Charles H. Dennison 2007-05-15 $17,522,000
7214632 Using selective deposition to form phase-change memory cells 2007-05-08 $17,693,000
7183567 Using selective deposition to form phase-change memory cells 2007-02-27 $10,067,000
7161225 Reducing shunts in memories with phase-change material Daniel Xu 2007-01-09 $12,865,000
7112887 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme Johanna M. Swan, Bala Natarajan, Greg Atwood, Valluri Rao 2006-09-26 $21,238,000
6949831 In-plane on-chip decoupling capacitors and method for making same David B. Fraser 2005-09-27 $20,905,000
6861267 Reducing shunts in memories with phase-change material Daniel Xu 2005-03-01 $28,008,000
6848177 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme Johanna M. Swan, Bala Natarajan, Greg Atwood, Valluri Rao 2005-02-01 $25,622,000
6797979 Metal structure for a phase-change memory device Jong Won Lee, Patrick Klersy 2004-09-28 $27,830,000
6777320 In-plane on-chip decoupling capacitors and method for making same David B. Fraser 2004-08-17 $19,443,000
6770524 Method to enhance performance of thermal resistor device Guy Wicker 2004-08-03 $15,005,000
6621095 Method to enhance performance of thermal resistor device Guy Wicker 2003-09-16
6569705 Metal structure for a phase-change memory device Jong Won Lee, Patrick Klersy 2003-05-27 $49,574,000
6545287 Using selective deposition to form phase-change memory cells 2003-04-08 $67,322,000
6339544 Method to enhance performance of thermal resistor device Guy Wicker 2002-01-15 $927,608,000
6309956 Fabricating low K dielectric interconnect systems by using dummy structures to enhance process David B. Fraser, Anne S. Mack, Jin Lee, Sing-Mo Tzeng, Chuanbin Pan +3 more 2001-10-30 $145,735,000
6303464 Method and structure for reducing interconnect system capacitance through enclosed voids in a dielectric layer Eng T. Gaw, Quat Vu, David B. Fraser, Ian A. Young, Thomas Marieb 2001-10-16 $231,350,000
6277765 Low-K Dielectric layer and method of making same Peng Cheng, Brian S. Doyle, Mark Thiec-Hien Tran 2001-08-21 $236,055,000
6239019 Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectrics David B. Fraser 2001-05-29 $200,835,000
6143647 Silicon-rich block copolymers to achieve unbalanced vias Chuanbin Pan 2000-11-07 $224,870,000
6051869 Silicon-rich block copolymers to achieve unbalanced vias Chuanbin Pan 2000-04-18 $334,401,000
6040628 Interconnect structure using a combination of hard dielectric and polymer as interlayer dielectrics David B. Fraser 2000-03-21 $323,907,000
6037249 Method for forming air gaps for advanced interconnect systems David B. Fraser, Vicky Ochoa, Chuanbin Pan, Sing-Mo Tzeng 2000-03-14 $200,527,000