Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6027995 | Method for fabricating an interconnect structure with hard mask and low dielectric constant materials | Chuanbin Pan, Vicky Ochoa, Sychyi Fang, David B. Fraser, Joyce C. Sum +2 more | 2000-02-22 |
| 5935868 | Interconnect structure and method to achieve unlanded vias for low dielectric constant materials | Sychyi Fang, Chaunbin Pan, Sing-Mo Tzeng | 1999-08-10 |
| 5886410 | Interconnect structure with hard mask and low dielectric constant materials | Chuanbin Pan, Vicky Ochoa, Sychyi Fang, David B. Fraser, Joyce C. Sum +2 more | 1999-03-23 |
| 5880030 | Unlanded via structure and method for making same | Sychyi Fang, David B. Fraser | 1999-03-09 |
| 5817572 | Method for forming multileves interconnections for semiconductor fabrication | David B. Fraser | 1998-10-06 |
| 5739579 | Method for forming interconnections for semiconductor fabrication and semiconductor device having such interconnections | David B. Fraser | 1998-04-14 |