Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6709885 | Method of fabricating image sensors using a thin film photodiode above active CMOS circuitry | Jack S. Uppal, David B. Fraser, Kevin M. Connolly | 2004-03-23 |
| 6501065 | Image sensor using a thin film photodiode above active CMOS circuitry | Jack S. Uppal, David B. Fraser, Kevin M. Connolly | 2002-12-31 |
| 6335627 | Apparatus and method for testing an electronics package substrate | — | 2002-01-01 |
| 6130422 | Embedded dielectric film for quantum efficiency enhancement in a CMOS imaging device | Edward J. Bawolek, Robert C. Sundahl, Berni W. Landau, Jack S. Uppal, Jung Kang | 2000-10-10 |
| 6029730 | Hot shear apparatus and method for removing a semiconductor chip from an existing package | George Chiu | 2000-02-29 |