| 6051114 |
Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition |
Tse-Yong Yao, Zheng Xu, Kenny King-Tai Ngan, Xing Chen, John Arthur Urbahn |
2000-04-18 |
| 5792522 |
High density plasma physical vapor deposition |
Shu Jin, Xiao-Chun Mu, Xing Chen |
1998-08-11 |
| 5688382 |
Microwave plasma deposition source and method of filling high aspect-ratio features on a substrate |
Matthew Besen, William M. Holber, Donald K. Smith, Richard S. Post |
1997-11-18 |
| 5518759 |
High growth rate plasma diamond deposition process and method of controlling same |
Evelio Sevillano, Richard S. Post |
1996-05-21 |
| 5405645 |
High growth rate plasma diamond deposition process and method of controlling same |
Evelio Sevillano, Richard S. Post |
1995-04-11 |
| 5279866 |
Process for depositing wear-resistant coatings |
Richard S. Post |
1994-01-18 |
