Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6051114 | Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition | Tse-Yong Yao, Zheng Xu, Kenny King-Tai Ngan, Xing Chen, John Arthur Urbahn | 2000-04-18 | $96,811,000 |
| 5792522 | High density plasma physical vapor deposition | Shu Jin, Xiao-Chun Mu, Xing Chen | 1998-08-11 | $73,522,000 |
| 5688382 | Microwave plasma deposition source and method of filling high aspect-ratio features on a substrate | Matthew Besen, William M. Holber, Donald K. Smith, Richard S. Post | 1997-11-18 | $1,763,000 |
| 5518759 | High growth rate plasma diamond deposition process and method of controlling same | Evelio Sevillano, Richard S. Post | 1996-05-21 | $1,013,000 |
| 5405645 | High growth rate plasma diamond deposition process and method of controlling same | Evelio Sevillano, Richard S. Post | 1995-04-11 | $638,000 |
| 5279866 | Process for depositing wear-resistant coatings | Richard S. Post | 1994-01-18 | $610,000 |