Issued Patents All Time
Showing 1–25 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7504008 | Refurbishment of sputtering targets | Trung T. Doan | 2009-03-17 |
| 7323230 | Coating for aluminum component | Trung T. Doan | 2008-01-29 |
| 7066795 | Polishing pad conditioner with shaped abrasive patterns and channels | Venkata R. Balagani, George Lazari | 2006-06-27 |
| 7053002 | Plasma preclean with argon, helium, and hydrogen gases | Barney M. Cohen, Xiangbing Li | 2006-05-30 |
| 7041200 | Reducing particle generation during sputter deposition | Hien Minh Le, Keith A. Miller, Hoa Kieu | 2006-05-09 |
| 7014887 | Sequential sputter and reactive precleans of vias and contacts | Barney M. Cohen, Suraj Rengarajan, Xiangbing Li, Peijun Ding | 2006-03-21 |
| 7006888 | Semiconductor wafer preheating | Hougong Wang, Zheng Xu | 2006-02-28 |
| 6945857 | Polishing pad conditioner and methods of manufacture and recycling | Trung T. Doan, Venkata R. Balagani | 2005-09-20 |
| 6899799 | Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma | Ying HUI, Seshadri Ramaswami | 2005-05-31 |
| 6672864 | Method and apparatus for processing substrates in a system having high and low pressure areas | Hougong Wang, Zheng Xu | 2004-01-06 |
| 6625003 | Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck | David H. Loo, Jr-Jyan Chen, Bradley O. Stimson | 2003-09-23 |
| 6589890 | Precleaning process for metal plug that minimizes damage to low-&kgr; dielectric | Barney M. Cohen, Suraj Rengarajan | 2003-07-08 |
| 6426282 | Method of forming solder bumps on a semiconductor wafer | Dinesh Saigal, Shankarram Athreya, Lisa Yang | 2002-07-30 |
| 6420260 | Ti/Tinx underlayer which enables a highly <111> oriented aluminum interconnect | Seshadri Ramaswami | 2002-07-16 |
| 6372301 | Method of improving adhesion of diffusion layers on fluorinated silicon dioxide | Murali Narasimhan, Vikram Pavate, Xiangbing Li | 2002-04-16 |
| 6346489 | Precleaning process for metal plug that minimizes damage to low-&kgr; dielectric | Barney M. Cohen, Suraj Rengarajan | 2002-02-12 |
| 6313042 | Cleaning contact with successive fluorine and hydrogen plasmas | Barney M. Cohen, Jingang Su, Jr-Jyan Chen | 2001-11-06 |
| 6267423 | End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector | Dan Marohl | 2001-07-31 |
| 6238533 | Integrated PVD system for aluminum hole filling using ionized metal adhesion layer | Peter Satitpunwaycha, Gongda Yao, Zheng Xu | 2001-05-29 |
| 6207027 | Method to reduce overhead time in an ion metal plasma process | — | 2001-03-27 |
| 6176978 | Pasting layer formation method for high density plasma deposition chambers | — | 2001-01-23 |
| 6149777 | Method of producing smooth titanium nitride films having low resistivity | Seshadri Ramaswami | 2000-11-21 |
| 6149784 | Sputtering chamber shield promoting reliable plasma ignition | Jingang Su, Nelson Yee, John C. Forster, Lisa Yang | 2000-11-21 |
| 6110836 | Reactive plasma etch cleaning of high aspect ratio openings | Barney M. Cohen, Jingang Su | 2000-08-29 |
| 6077353 | Pedestal insulator for a pre-clean chamber | Mohamed Al-Sharif, Bradley O. Stimson, Debabrata Ghosh, Barney M. Cohen, Murali Narasimhan | 2000-06-20 |