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Side storage pods, equipment front end modules, and methods for operating equipment front end modules |
Patrick D. Pannese, Paul B. Reuter, Nir Merry |
2023-09-05 |
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Oxidation inhibiting gas in a manufacturing system |
Patrick D. Pannese, Kunal Jain |
2023-01-31 |
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High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods |
Paul B. Reuter, Amulya L. Athayde, Patrick D. Pannese, Dean C. Hruzek, Nir Merry |
2022-02-08 |
| 9305838 |
BEOL interconnect with carbon nanotubes |
Pravin K. Narwankar, JOE GRIFFITH CRUZ, Arvind Sundarrajan, Subbalakshmi Sreekala, Victor L. Pushparaj |
2016-04-05 |
| 9209074 |
Cobalt deposition on barrier surfaces |
Jiang Lu, Hyoung-Chan Ha, Paul F. Ma, Seshadri Ganguli, Joseph AuBuchon +1 more |
2015-12-08 |
| 9051641 |
Cobalt deposition on barrier surfaces |
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2015-06-09 |
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High temperature tungsten metallization process |
Joshua Collins, Jingjing Liu, Sang-Hyeob Lee, Kai Wu, Avgerinos V. Gelatos |
2014-09-16 |
| 8764961 |
Cu surface plasma treatment to improve gapfill window |
Qian Luo, Arvind Sundarrajan, Hua Chung, Xianmin Tang, Jick Yu |
2014-07-01 |
| 8642473 |
Methods for contact clean |
Mei Chang, Linh Thanh, Bo Zheng, Arvind Sundarrajan, John C. Forster +1 more |
2014-02-04 |
| 8617985 |
High temperature tungsten metallization process |
Joshua Collins, Jingjing Liu, Sang-Hyeob Lee, Kai Wu, Avgerinos V. Gelatos |
2013-12-31 |
| 7050160 |
Process and apparatus for integrating sheet resistance measurements and reflectance measurements of a thin film in a common apparatus |
Walter H. Johnson, Jagadish Kalyanam, Shankar Krishnan |
2006-05-23 |
| 6432819 |
Method and apparatus of forming a sputtered doped seed layer |
Vikram Pavate |
2002-08-13 |
| 6391163 |
Method of enhancing hardness of sputter deposited copper films |
Vikram Pavate, Murali Abburi, Seshadri Ramaswami |
2002-05-21 |
| 6372301 |
Method of improving adhesion of diffusion layers on fluorinated silicon dioxide |
Vikram Pavate, Kenny King-Tai Ngan, Xiangbing Li |
2002-04-16 |
| 6315872 |
Coil for sputter deposition |
Vikram Pavate |
2001-11-13 |
| 6277253 |
External coating of tungsten or tantalum or other refractory metal on IMP coils |
Xiangbing Li |
2001-08-21 |
| 6228186 |
Method for manufacturing metal sputtering target for use in DC magnetron so that target has reduced number of conduction anomalies |
Vikram Pavate, Keith J. Hansen, Glen T. Mori, Seshadri Ramaswami, Jaim Nulman |
2001-05-08 |
| 6171455 |
Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target |
Vikram Pavate, Keith J. Hansen, Glen T. Mori, Seshadri Ramaswami, Jaim Nulman |
2001-01-09 |
| 6139701 |
Copper target for sputter deposition |
Vikram Pavate, Seshadri Ramaswami, Murali Abburi |
2000-10-31 |
| 6126791 |
Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target |
Vikram Pavate, Keith J. Hansen, Glen T. Mori, Seshadri Ramaswami, Jaim Nulman |
2000-10-03 |
| 6122921 |
Shield to prevent cryopump charcoal array from shedding during cryo-regeneration |
Thomas Brezoczky |
2000-09-26 |
| 6077353 |
Pedestal insulator for a pre-clean chamber |
Mohamed Al-Sharif, Bradley O. Stimson, Debabrata Ghosh, Barney M. Cohen, Kenny King-Tai Ngan |
2000-06-20 |
| 6042700 |
Adjustment of deposition uniformity in an inductively coupled plasma source |
Praburam Gopalraja |
2000-03-28 |
| 6001227 |
Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target |
Vikram Pavate, Keith J. Hansen, Glen T. Mori, Seshadri Ramaswami, Jaim Nulman |
1999-12-14 |
| 5972178 |
Continuous process for forming improved titanium nitride barrier layers |
Kenny King-Tai Ngan, Nitin Khurana, Bradley O. Stimson |
1999-10-26 |
