Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749537 | Side storage pods, equipment front end modules, and methods for operating equipment front end modules | Patrick D. Pannese, Paul B. Reuter, Nir Merry | 2023-09-05 |
| 11569102 | Oxidation inhibiting gas in a manufacturing system | Patrick D. Pannese, Kunal Jain | 2023-01-31 |
| 11244844 | High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods | Paul B. Reuter, Amulya L. Athayde, Patrick D. Pannese, Dean C. Hruzek, Nir Merry | 2022-02-08 |
| 9305838 | BEOL interconnect with carbon nanotubes | Pravin K. Narwankar, JOE GRIFFITH CRUZ, Arvind Sundarrajan, Subbalakshmi Sreekala, Victor L. Pushparaj | 2016-04-05 |
| 9209074 | Cobalt deposition on barrier surfaces | Jiang Lu, Hyoung-Chan Ha, Paul F. Ma, Seshadri Ganguli, Joseph AuBuchon +1 more | 2015-12-08 |
| 9051641 | Cobalt deposition on barrier surfaces | Jiang Lu, Hyoung-Chan Ha, Paul F. Ma, Seshadri Ganguli, Joseph AuBuchon +1 more | 2015-06-09 |
| 8835311 | High temperature tungsten metallization process | Joshua Collins, Jingjing Liu, Sang-Hyeob Lee, Kai Wu, Avgerinos V. Gelatos | 2014-09-16 |
| 8764961 | Cu surface plasma treatment to improve gapfill window | Qian Luo, Arvind Sundarrajan, Hua Chung, Xianmin Tang, Jick Yu | 2014-07-01 |
| 8642473 | Methods for contact clean | Mei Chang, Linh Thanh, Bo Zheng, Arvind Sundarrajan, John C. Forster +1 more | 2014-02-04 |
| 8617985 | High temperature tungsten metallization process | Joshua Collins, Jingjing Liu, Sang-Hyeob Lee, Kai Wu, Avgerinos V. Gelatos | 2013-12-31 |
| 7050160 | Process and apparatus for integrating sheet resistance measurements and reflectance measurements of a thin film in a common apparatus | Walter H. Johnson, Jagadish Kalyanam, Shankar Krishnan | 2006-05-23 |
| 6432819 | Method and apparatus of forming a sputtered doped seed layer | Vikram Pavate | 2002-08-13 |
| 6391163 | Method of enhancing hardness of sputter deposited copper films | Vikram Pavate, Murali Abburi, Seshadri Ramaswami | 2002-05-21 |
| 6372301 | Method of improving adhesion of diffusion layers on fluorinated silicon dioxide | Vikram Pavate, Kenny King-Tai Ngan, Xiangbing Li | 2002-04-16 |
| 6315872 | Coil for sputter deposition | Vikram Pavate | 2001-11-13 |
| 6277253 | External coating of tungsten or tantalum or other refractory metal on IMP coils | Xiangbing Li | 2001-08-21 |
| 6228186 | Method for manufacturing metal sputtering target for use in DC magnetron so that target has reduced number of conduction anomalies | Vikram Pavate, Keith J. Hansen, Glen T. Mori, Seshadri Ramaswami, Jaim Nulman | 2001-05-08 |
| 6171455 | Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target | Vikram Pavate, Keith J. Hansen, Glen T. Mori, Seshadri Ramaswami, Jaim Nulman | 2001-01-09 |
| 6139701 | Copper target for sputter deposition | Vikram Pavate, Seshadri Ramaswami, Murali Abburi | 2000-10-31 |
| 6126791 | Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target | Vikram Pavate, Keith J. Hansen, Glen T. Mori, Seshadri Ramaswami, Jaim Nulman | 2000-10-03 |
| 6122921 | Shield to prevent cryopump charcoal array from shedding during cryo-regeneration | Thomas Brezoczky | 2000-09-26 |
| 6077353 | Pedestal insulator for a pre-clean chamber | Mohamed Al-Sharif, Bradley O. Stimson, Debabrata Ghosh, Barney M. Cohen, Kenny King-Tai Ngan | 2000-06-20 |
| 6042700 | Adjustment of deposition uniformity in an inductively coupled plasma source | Praburam Gopalraja | 2000-03-28 |
| 6001227 | Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target | Vikram Pavate, Keith J. Hansen, Glen T. Mori, Seshadri Ramaswami, Jaim Nulman | 1999-12-14 |
| 5972178 | Continuous process for forming improved titanium nitride barrier layers | Kenny King-Tai Ngan, Nitin Khurana, Bradley O. Stimson | 1999-10-26 |