| 6660135 |
Staged aluminum deposition process for filling vias |
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2003-12-09 |
| 6521107 |
Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life |
Seshadri Ramaswami |
2003-02-18 |
| 6472867 |
Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life |
Seshadri Ramaswami |
2002-10-29 |
| 6436207 |
Manufacture of target for use in magnetron sputtering of nickel and like magnetic metals for forming metallization films having consistent uniformity through life |
Seshadri Ramaswami |
2002-08-20 |
| 6391163 |
Method of enhancing hardness of sputter deposited copper films |
Vikram Pavate, Murali Narasimhan, Seshadri Ramaswami |
2002-05-21 |
| 6352620 |
Staged aluminum deposition process for filling vias |
Sang Ho Yu, Yonghwa Chris Cha, Shri Singhvi, Fufa Chen |
2002-03-05 |
| 6139701 |
Copper target for sputter deposition |
Vikram Pavate, Seshadri Ramaswami, Murali Narasimhan |
2000-10-31 |
| 6086725 |
Target for use in magnetron sputtering of nickel for forming metallization films having consistent uniformity through life |
Seshadri Ramaswami |
2000-07-11 |
