Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6660135 | Staged aluminum deposition process for filling vias | Sang Ho Yu, Yonghwa Chris Cha, Murali Abburi, Fufa Chen | 2003-12-09 |
| 6368880 | Barrier applications for aluminum planarization | Suraj Rengarajan, Peijun Ding, Gongda Yao | 2002-04-09 |
| 6352620 | Staged aluminum deposition process for filling vias | Sang Ho Yu, Yonghwa Chris Cha, Murali Abburi, Fufa Chen | 2002-03-05 |
| 6207558 | Barrier applications for aluminum planarization | Suraj Rengarajan, Peijun Ding, Gongda Yao | 2001-03-27 |