Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991157 | Method for depositing a diffusion barrier layer and a metal conductive layer | Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2018-06-05 |
| 9390970 | Method for depositing a diffusion barrier layer and a metal conductive layer | Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2016-07-12 |
| 8158511 | Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features | Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2012-04-17 |
| 7989343 | Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features | Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2011-08-02 |
| 7795138 | Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate | Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2010-09-14 |
| 7687909 | Metal / metal nitride barrier layer for semiconductor device applications | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more | 2010-03-30 |
| 7589016 | Method of depositing a sculptured copper seed layer | Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2009-09-15 |
| 7381639 | Method of depositing a metal seed layer on semiconductor substrates | Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2008-06-03 |
| 7253109 | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more | 2007-08-07 |
| 7074714 | Method of depositing a metal seed layer on semiconductor substrates | Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2006-07-11 |
| 6939801 | Selective deposition of a barrier layer on a dielectric material | Hua Chung, Ling Chen, Vincent Ku, Michael Yang | 2005-09-06 |
| 6919275 | Method of preventing diffusion of copper through a tantalum-comprising barrier layer | Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2005-07-19 |
| 6908865 | Method and apparatus for cleaning substrates | Martin Kranz, Srinivas Guggilla, Suraj Rengarajan, Mei Chang, Nitin Khurana +1 more | 2005-06-21 |
| 6758947 | Damage-free sculptured coating deposition | Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more | 2004-07-06 |
| 6528180 | Liner materials | Wei Ti Lee, Ted Guo | 2003-03-04 |
| 6451179 | Method and apparatus for enhancing sidewall coverage during sputtering in a chamber having an inductively coupled plasma | Zheng Xu | 2002-09-17 |
| 6383915 | Tailoring of a wetting/barrier layer to reduce electromigration in an aluminum interconnect | Jingang Su, Zhang Xu, Fusen Chen | 2002-05-07 |
| 6368880 | Barrier applications for aluminum planarization | Shri Singhvi, Suraj Rengarajan, Peijun Ding | 2002-04-09 |
| 6303994 | Method and apparatus for reducing the first wafer effect | Hougong Wang | 2001-10-16 |
| 6299689 | Reflow chamber and process | Hougong Wang, Steve Lai, Peijun Ding | 2001-10-09 |
| 6271592 | Sputter deposited barrier layers | Edwin Kim, Michael Nam, Chris Cha, Sophia Lee, Fernand Dorleans +2 more | 2001-08-07 |
| 6238533 | Integrated PVD system for aluminum hole filling using ionized metal adhesion layer | Peter Satitpunwaycha, Kenny King-Tai Ngan, Zheng Xu | 2001-05-29 |
| 6232665 | Silicon-doped titanium wetting layer for aluminum plug | Peijun Ding, Zheng Xu, Hoa Kieu | 2001-05-15 |
| 6207558 | Barrier applications for aluminum planarization | Shri Singhvi, Suraj Rengarajan, Peijun Ding | 2001-03-27 |
| 6139698 | Method and apparatus for reducing the first wafer effect | Hougong Wang | 2000-10-31 |