| 9991157 |
Method for depositing a diffusion barrier layer and a metal conductive layer |
Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more |
2018-06-05 |
$36,422,000 |
| 9390970 |
Method for depositing a diffusion barrier layer and a metal conductive layer |
Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more |
2016-07-12 |
$13,832,000 |
| 8158511 |
Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features |
Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more |
2012-04-17 |
$9,496,000 |
| 7989343 |
Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features |
Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more |
2011-08-02 |
$5,317,000 |
| 7795138 |
Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate |
Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more |
2010-09-14 |
$9,681,000 |
| 7687909 |
Metal / metal nitride barrier layer for semiconductor device applications |
Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more |
2010-03-30 |
$22,482,000 |
| 7589016 |
Method of depositing a sculptured copper seed layer |
Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more |
2009-09-15 |
$12,042,000 |
| 7381639 |
Method of depositing a metal seed layer on semiconductor substrates |
Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more |
2008-06-03 |
$34,287,000 |
| 7253109 |
Method of depositing a tantalum nitride/tantalum diffusion barrier layer system |
Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more |
2007-08-07 |
$22,752,000 |
| 7074714 |
Method of depositing a metal seed layer on semiconductor substrates |
Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more |
2006-07-11 |
$12,872,000 |
| 6939801 |
Selective deposition of a barrier layer on a dielectric material |
Hua Chung, Ling Chen, Vincent Ku, Michael Yang |
2005-09-06 |
$20,356,000 |
| 6919275 |
Method of preventing diffusion of copper through a tantalum-comprising barrier layer |
Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more |
2005-07-19 |
$46,519,000 |
| 6908865 |
Method and apparatus for cleaning substrates |
Martin Kranz, Srinivas Guggilla, Suraj Rengarajan, Mei Chang, Nitin Khurana +1 more |
2005-06-21 |
$30,094,000 |
| 6758947 |
Damage-free sculptured coating deposition |
Tony P. Chiang, Peijun Ding, Fusen Chen, Barry Chin, Gene Y. Kohara +2 more |
2004-07-06 |
$50,005,000 |
| 6528180 |
Liner materials |
Wei Ti Lee, Ted Guo |
2003-03-04 |
$29,443,000 |
| 6451179 |
Method and apparatus for enhancing sidewall coverage during sputtering in a chamber having an inductively coupled plasma |
Zheng Xu |
2002-09-17 |
$18,500,000 |
| 6383915 |
Tailoring of a wetting/barrier layer to reduce electromigration in an aluminum interconnect |
Jingang Su, Zhang Xu, Fusen Chen |
2002-05-07 |
$97,318,000 |
| 6368880 |
Barrier applications for aluminum planarization |
Shri Singhvi, Suraj Rengarajan, Peijun Ding |
2002-04-09 |
$34,803,000 |
| 6303994 |
Method and apparatus for reducing the first wafer effect |
Hougong Wang |
2001-10-16 |
$34,819,000 |
| 6299689 |
Reflow chamber and process |
Hougong Wang, Steve Lai, Peijun Ding |
2001-10-09 |
$40,152,000 |
| 6271592 |
Sputter deposited barrier layers |
Edwin Kim, Michael Nam, Chris Cha, Sophia Lee, Fernand Dorleans +2 more |
2001-08-07 |
$53,916,000 |
| 6238533 |
Integrated PVD system for aluminum hole filling using ionized metal adhesion layer |
Peter Satitpunwaycha, Kenny King-Tai Ngan, Zheng Xu |
2001-05-29 |
$105,746,000 |
| 6232665 |
Silicon-doped titanium wetting layer for aluminum plug |
Peijun Ding, Zheng Xu, Hoa Kieu |
2001-05-15 |
$105,754,000 |
| 6207558 |
Barrier applications for aluminum planarization |
Shri Singhvi, Suraj Rengarajan, Peijun Ding |
2001-03-27 |
$69,548,000 |
| 6139698 |
Method and apparatus for reducing the first wafer effect |
Hougong Wang |
2000-10-31 |
$72,215,000 |
