| 12011801 |
Printing a chemical mechanical polishing pad |
Rajeev Bajaj, Terrance Y. Lee |
2024-06-18 |
$83,264,000 |
| 11673225 |
Printing a chemical mechanical polishing pad |
Rajeev Bajaj, Terrance Y. Lee |
2023-06-13 |
$42,513,000 |
| 11207758 |
Printing a chemical mechanical polishing pad |
Rajeev Bajaj, Terrance Y. Lee |
2021-12-28 |
$93,125,000 |
| 10843306 |
Printing a chemical mechanical polishing pad |
Rajeev Bajaj, Terrance Y. Lee |
2020-11-24 |
$38,395,000 |
| 10029405 |
Printing a chemical mechanical polishing pad |
Rajeev Bajaj, Terrance Y. Lee |
2018-07-24 |
$37,876,000 |
| 9991157 |
Method for depositing a diffusion barrier layer and a metal conductive layer |
Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more |
2018-06-05 |
$36,422,000 |
| 9829805 |
Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor |
Timothy Michaelson, Timothy Weidman, Majeed A. Foad, Paul Deaton |
2017-11-28 |
$20,834,000 |
| 9744724 |
Apparatus for printing a chemical mechanical polishing pad |
Rajeev Bajaj, Terrance Y. Lee |
2017-08-29 |
$19,098,000 |
| 9632411 |
Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor |
Timothy Michaelson, Timothy Weidman, Majeed A. Foad, Paul Deaton |
2017-04-25 |
$22,808,000 |
| 9457520 |
Apparatus for printing a chemical mechanical polishing pad |
Rajeev Bajaj, Terrance Y. Lee |
2016-10-04 |
$14,162,000 |
| 9390970 |
Method for depositing a diffusion barrier layer and a metal conductive layer |
Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more |
2016-07-12 |
$13,832,000 |
| 9067299 |
Printed chemical mechanical polishing pad |
Rajeev Bajaj, Terrance Y. Lee |
2015-06-30 |
$11,421,000 |
| 9031685 |
Atomic layer deposition apparatus |
Alfred Mak, Lawrence Chung-Lai Lei, Ming Xi, Hua Chung, Ken Kaung Lai +1 more |
2015-05-12 |
$26,933,000 |
| 8626330 |
Atomic layer deposition apparatus |
Alfred Mak, Lawrence Chung-Lai Lei, Ming Xi, Hua Chung, Ken Kaung Lai +1 more |
2014-01-07 |
$24,959,000 |
| 8586481 |
Chemical planarization of copper wafer polishing |
You Wang, Wen-Chiang Tu, Feng Q. Liu, Yuchun Wang, Lakshmanan Karuppiah +1 more |
2013-11-19 |
$10,370,000 |
| 8318266 |
Enhanced copper growth with ultrathin barrier layer for high performance interconnects |
Ling Chen, Hua Chung, Hong Mei Zhang |
2012-11-27 |
$5,138,000 |
| 8293328 |
Enhanced copper growth with ultrathin barrier layer for high performance interconnects |
Ling Chen, Hua Chung, Hong Mei Zhang |
2012-10-23 |
$4,153,000 |
| 8158511 |
Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features |
Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more |
2012-04-17 |
$9,496,000 |
| 8027746 |
Atomic layer deposition apparatus |
Alfred Mak, Lawrence Chung-Lai Lei, Ming Xi, Hua Chung, Ken Kaung Lai +1 more |
2011-09-27 |
$17,577,000 |
| 7989343 |
Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features |
Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more |
2011-08-02 |
$5,317,000 |
| 7892602 |
Cyclical deposition of refractory metal silicon nitride |
Hua Chung, Ling Chen |
2011-02-22 |
$45,924,000 |
| 7860597 |
Atomic layer deposition apparatus |
Alfred Mak, Lawrence Chung-Lai Lei, Ming Xi, Hua Chung, Ken Kaung Lai +1 more |
2010-12-28 |
$12,129,000 |
| 7795138 |
Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate |
Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more |
2010-09-14 |
$9,681,000 |
| 7687909 |
Metal / metal nitride barrier layer for semiconductor device applications |
Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more |
2010-03-30 |
$22,482,000 |
| 7660644 |
Atomic layer deposition apparatus |
Alfred Mak, Lawrence Chung-Lai Lei, Ming Xi, Hua Chung, Ken Kaung Lai +1 more |
2010-02-09 |
$11,111,000 |
