Issued Patents All Time
Showing 25 most recent of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12011801 | Printing a chemical mechanical polishing pad | Rajeev Bajaj, Terrance Y. Lee | 2024-06-18 |
| 11673225 | Printing a chemical mechanical polishing pad | Rajeev Bajaj, Terrance Y. Lee | 2023-06-13 |
| 11207758 | Printing a chemical mechanical polishing pad | Rajeev Bajaj, Terrance Y. Lee | 2021-12-28 |
| 10843306 | Printing a chemical mechanical polishing pad | Rajeev Bajaj, Terrance Y. Lee | 2020-11-24 |
| 10029405 | Printing a chemical mechanical polishing pad | Rajeev Bajaj, Terrance Y. Lee | 2018-07-24 |
| 9991157 | Method for depositing a diffusion barrier layer and a metal conductive layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more | 2018-06-05 |
| 9829805 | Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor | Timothy Michaelson, Timothy Weidman, Majeed A. Foad, Paul Deaton | 2017-11-28 |
| 9744724 | Apparatus for printing a chemical mechanical polishing pad | Rajeev Bajaj, Terrance Y. Lee | 2017-08-29 |
| 9632411 | Vapor deposition deposited photoresist, and manufacturing and lithography systems therefor | Timothy Michaelson, Timothy Weidman, Majeed A. Foad, Paul Deaton | 2017-04-25 |
| 9457520 | Apparatus for printing a chemical mechanical polishing pad | Rajeev Bajaj, Terrance Y. Lee | 2016-10-04 |
| 9390970 | Method for depositing a diffusion barrier layer and a metal conductive layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more | 2016-07-12 |
| 9067299 | Printed chemical mechanical polishing pad | Rajeev Bajaj, Terrance Y. Lee | 2015-06-30 |
| 9031685 | Atomic layer deposition apparatus | Alfred Mak, Lawrence Chung-Lai Lei, Ming Xi, Hua Chung, Ken Kaung Lai +1 more | 2015-05-12 |
| 8626330 | Atomic layer deposition apparatus | Alfred Mak, Lawrence Chung-Lai Lei, Ming Xi, Hua Chung, Ken Kaung Lai +1 more | 2014-01-07 |
| 8586481 | Chemical planarization of copper wafer polishing | You Wang, Wen-Chiang Tu, Feng Q. Liu, Yuchun Wang, Lakshmanan Karuppiah +1 more | 2013-11-19 |
| 8318266 | Enhanced copper growth with ultrathin barrier layer for high performance interconnects | Ling Chen, Hua Chung, Hong Mei Zhang | 2012-11-27 |
| 8293328 | Enhanced copper growth with ultrathin barrier layer for high performance interconnects | Ling Chen, Hua Chung, Hong Mei Zhang | 2012-10-23 |
| 8158511 | Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more | 2012-04-17 |
| 8027746 | Atomic layer deposition apparatus | Alfred Mak, Lawrence Chung-Lai Lei, Ming Xi, Hua Chung, Ken Kaung Lai +1 more | 2011-09-27 |
| 7989343 | Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more | 2011-08-02 |
| 7892602 | Cyclical deposition of refractory metal silicon nitride | Hua Chung, Ling Chen | 2011-02-22 |
| 7860597 | Atomic layer deposition apparatus | Alfred Mak, Lawrence Chung-Lai Lei, Ming Xi, Hua Chung, Ken Kaung Lai +1 more | 2010-12-28 |
| 7795138 | Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more | 2010-09-14 |
| 7687909 | Metal / metal nitride barrier layer for semiconductor device applications | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more | 2010-03-30 |
| 7660644 | Atomic layer deposition apparatus | Alfred Mak, Lawrence Chung-Lai Lei, Ming Xi, Hua Chung, Ken Kaung Lai +1 more | 2010-02-09 |