Issued Patents All Time
Showing 26–50 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7589016 | Method of depositing a sculptured copper seed layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more | 2009-09-15 |
| 7381639 | Method of depositing a metal seed layer on semiconductor substrates | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more | 2008-06-03 |
| 7253109 | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more | 2007-08-07 |
| 7085616 | Atomic layer deposition apparatus | Alfred Mak, Lawrence Chung-Lai Lei, Ming Xi, Hua Chung, Ken Kaung Lai +1 more | 2006-08-01 |
| 7081271 | Cyclical deposition of refractory metal silicon nitride | Hua Chung, Ling Chen | 2006-07-25 |
| 7074714 | Method of depositing a metal seed layer on semiconductor substrates | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more | 2006-07-11 |
| 7048837 | End point detection for sputtering and resputtering | Sasson Somekh, Marc Schweitzer, John C. Forster, Zheng Xu, Roderick C. Mosely +1 more | 2006-05-23 |
| 6992012 | Method and apparatus for forming improved metal interconnects | Imran Hashim, Tony P. Chiang | 2006-01-31 |
| 6919275 | Method of preventing diffusion of copper through a tantalum-comprising barrier layer | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more | 2005-07-19 |
| 6887353 | Tailored barrier layer which provides improved copper interconnect electromigration resistance | Peijun Ding, Tony P. Chiang | 2005-05-03 |
| 6881673 | Integrated deposition process for copper metallization | Peijun Ding, Imran Hashim, Bingxi Sun | 2005-04-19 |
| 6793779 | Sputtering method for filling holes with copper | Peijun Ding, Tony P. Chiang | 2004-09-21 |
| 6790776 | Barrier layer for electroplating processes | Peijun Ding, Tony P. Chiang, Tse-Yong Yao | 2004-09-14 |
| 6758947 | Damage-free sculptured coating deposition | Tony P. Chiang, Gongda Yao, Peijun Ding, Fusen Chen, Gene Y. Kohara +2 more | 2004-07-06 |
| 6753248 | Post metal barrier/adhesion film | Michael Anthony Wood, Paul Smith, Robin Cheung | 2004-06-22 |
| 6709987 | Method and apparatus for forming improved metal interconnects | Imran Hashim, Tony P. Chiang | 2004-03-23 |
| 6620956 | Nitrogen analogs of copper II &bgr;-diketonates as source reagents for semiconductor processing | Ling Chen | 2003-09-16 |
| 6605197 | Method of sputtering copper to fill trenches and vias | Peijun Ding, Tony P. Chiang | 2003-08-12 |
| 6566259 | Integrated deposition process for copper metallization | Peijun Ding, Imran Hashim, Bingxi Sun | 2003-05-20 |
| 6559061 | Method and apparatus for forming improved metal interconnects | Imran Hashim, Tony P. Chiang | 2003-05-06 |
| 6488823 | Stress tunable tantalum and tantalum nitride films | Tony P. Chiang, Peijun Ding, Bingxi Sun | 2002-12-03 |
| 6458251 | Pressure modulation method to obtain improved step coverage of seed layer | Arvind Sundarrajan, Darryl Angelo, Peijun Ding, Imran Hasim | 2002-10-01 |
| 6458255 | Ultra-low resistivity tantalum films and methods for their deposition | Tony P. Chiang, Peijun Ding | 2002-10-01 |
| 6436267 | Method for achieving copper fill of high aspect ratio interconnect features | Daniel Carl, Liang-Yuh Chen, Robin Cheung, Peijun Ding, Yezdi Dordi +3 more | 2002-08-20 |
| 6399479 | Processes to improve electroplating fill | Fusen Chen, Zheng Xu, Peijun Ding, Ashok Sinha | 2002-06-04 |