Issued Patents All Time
Showing 25 most recent of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798606 | Additive patterning of semiconductor film stacks | John O. Dukovic, Srinivas D. Nemani, Ellie Yieh, Steven Hiloong WELCH, Bhargav S. Citla | 2023-10-24 |
| 11315943 | Bottom-up approach to high aspect ratio hole formation in 3D memory structures | Susmit Singha Roy, Abhijit Basu Mallick, Srinivas Gandikota | 2022-04-26 |
| 11177164 | Self-aligned high aspect ratio structures and methods of making | Susmit Singha Roy, Abhijit Basu Mallick, Srinivas Gandikota | 2021-11-16 |
| 11049537 | Additive patterning of semiconductor film stacks | John O. Dukovic, Srinivas D. Nemani, Ellie Yieh, Steven Hiloong WELCH, Bhargav S. Citla | 2021-06-29 |
| 10957518 | Chamber with individually controllable plasma generation regions for a reactor for processing a workpiece | Kartik Ramaswamy, Lawrence Wong, Steven Lane, Yang Yang, Srinivas D. Nemani | 2021-03-23 |
| 10840186 | Methods of forming self-aligned vias and air gaps | Susmit Singha Roy, Ziqing Duan, Abhijit Basu Mallick | 2020-11-17 |
| 10597785 | Single oxide metal deposition chamber | Anantha K. Subramani, Tza-Jing Gung, Hari Ponnekanti, Philip Allan Kraus | 2020-03-24 |
| 10577689 | Sputtering showerhead | Anantha K. Subramani, Tza-Jing Gung, Hari Ponnekanti | 2020-03-03 |
| 10403542 | Methods of forming self-aligned vias and air gaps | Susmit Singha Roy, Ziqing Duan, Abhijit Basu Mallick | 2019-09-03 |
| 10047430 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2018-08-14 |
| 9978596 | Self-aligned multiple spacer patterning schemes for advanced nanometer technology | Ying Zhang, Uday Mitra, Srinivas D. Nemani, Hua Chung | 2018-05-22 |
| 9548201 | Self-aligned multiple spacer patterning schemes for advanced nanometer technology | Ying Zhang, Uday Mitra, Srinivas D. Nemani, Hua Chung | 2017-01-17 |
| 9062372 | Self-ionized and capacitively-coupled plasma for sputtering and resputtering | Jianming Fu, Xianmin Tang, John C. Forster, Umesh M. Kelkar | 2015-06-23 |
| 8871064 | Electromagnet array in a sputter reactor | Tza-Jing Gung, Xinyu Fu, Arvind Sundarrajan, Edward P. Hammond, IV, John C. Forster +2 more | 2014-10-28 |
| 8696875 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2014-04-15 |
| 8668816 | Self-ionized and inductively-coupled plasma for sputtering and resputtering | Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more | 2014-03-11 |
| 8557094 | Sputtering chamber having auxiliary backside magnet to improve etch uniformity and magnetron producing sustained self sputtering of ruthenium and tantalum | Xianmin Tang, Hua Chung, Rongjun Wang, Tza-Jing Gung, Jick Yu +1 more | 2013-10-15 |
| 8398832 | Coils for generating a plasma and for sputtering | Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard Grunes +2 more | 2013-03-19 |
| 7737028 | Selective ruthenium deposition on copper materials | Rongjun Wang, Hua Chung, Jick Yu | 2010-06-15 |
| 7704887 | Remote plasma pre-clean with low hydrogen pressure | Xinyu Fu, John C. Forster, Jick Yu, Ajay Bhatnagar | 2010-04-27 |
| 7687909 | Metal / metal nitride barrier layer for semiconductor device applications | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Suraj Rengarajan +7 more | 2010-03-30 |
| 7686926 | Multi-step process for forming a metal barrier in a sputter reactor | Tza-Jing Gung, Xinyu Fu, Arvind Sundarrajan, Edward P. Hammond, IV, John C. Forster +2 more | 2010-03-30 |
| 7659204 | Oxidized barrier layer | Xianmin Tang, Hua Chung, Rongjun Wang, Jick Yu, Jenn-Yue Wang | 2010-02-09 |
| 7547644 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Fusen Chen, Ling Chen, Walter Glenn, Jianming Fu | 2009-06-16 |
| 7504006 | Self-ionized and capacitively-coupled plasma for sputtering and resputtering | Jianming Fu, Xianmin Tang, John C. Forster, Umesh M. Kelkar | 2009-03-17 |