Issued Patents All Time
Showing 51–75 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6451177 | Vault shaped target and magnetron operable in two sputtering modes | Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu, Wei Wang +1 more | 2002-09-17 |
| 6444104 | Sputtering target having an annular vault | Jianming Fu | 2002-09-03 |
| 6436251 | Vault-shaped target and magnetron having both distributed and localized magnets | Jianming Fu, Wei Wang | 2002-08-20 |
| 6413382 | Pulsed sputtering with a small rotating magnetron | Wei Wang, Jianming Fu, Zheng Xu | 2002-07-02 |
| 6409890 | Method and apparatus for forming a uniform layer on a workpiece during sputtering | Howard Grunes, Zheng Xu, John C. Forster, Ralf Hofmann, Anantha K. Subramani | 2002-06-25 |
| 6406599 | Magnetron with a rotating center magnet for a vault shaped sputtering target | Anantha K. Subramani, Umesh M. Kelkar, Jianming Fu | 2002-06-18 |
| 6368469 | Coils for generating a plasma and for sputtering | Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard Grunes +2 more | 2002-04-09 |
| 6358376 | Biased shield in a magnetron sputter reactor | Wei Wang, Jianming Fu | 2002-03-19 |
| 6350353 | Alternate steps of IMP and sputtering process to improve sidewall coverage | Sergio Edelstein, Avi Tepman, Peijun Ding, Debabrata Ghosh, Nirmalya Maity | 2002-02-26 |
| 6344419 | Pulsed-mode RF bias for sidewall coverage improvement | John C. Forster, Bradley O. Stimson, Liubo Hong | 2002-02-05 |
| D450070 | Sputtering chamber coil | Zheng Xu, Michael Rosenstein, John C. Forster | 2001-11-06 |
| 6306265 | High-density plasma for ionized metal deposition capable of exciting a plasma wave | Jianming Fu, Fusen Chen, John C. Forster | 2001-10-23 |
| 6277249 | Integrated process for copper via filling using a magnetron and target producing highly energetic ions | Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu, Sankaram Athreya +2 more | 2001-08-21 |
| 6274008 | Integrated process for copper via filling | Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu, Sankaram Athreya +2 more | 2001-08-14 |
| 6254738 | Use of variable impedance having rotating core to control coil sputter distribution | Bradley O. Stimson, Kenneth Smyth | 2001-07-03 |
| 6251242 | Magnetron and target producing an extended plasma region in a sputter reactor | Jianming Fu | 2001-06-26 |
| D442852 | Squared overlap coil | John C. Forster, Michael Rosenstein | 2001-05-29 |
| D442853 | Rounded overlap coil | John C. Forster, Michael Rosenstein | 2001-05-29 |
| 6235169 | Modulated power for ionized metal plasma deposition | John C. Forster, Zheng Xu, Bradley O. Stimson | 2001-05-22 |
| 6221221 | Apparatus for providing RF return current path control in a semiconductor wafer processing system | Ayad A. Al-Shaikh, Michael Rosenstein, Bradley O. Stimson, Jianming Fu | 2001-04-24 |
| D440582 | Sputtering chamber coil | Zheng Xu, Michael Rosenstein, John C. Forster, Peijun Ding | 2001-04-17 |
| 6193855 | Use of modulated inductive power and bias power to reduce overhang and improve bottom coverage | John C. Forster | 2001-02-27 |
| 6146508 | Sputtering method and apparatus with small diameter RF coil | Zheng Xu, Ralf Hofmann | 2000-11-14 |
| 6143140 | Method and apparatus to improve the side wall and bottom coverage in IMP process by using magnetic field | Wei Wang, Keith A. Miller, James Gogh | 2000-11-07 |
| 6042700 | Adjustment of deposition uniformity in an inductively coupled plasma source | Murali Narasimhan | 2000-03-28 |