| 8398832 |
Coils for generating a plasma and for sputtering |
Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Avi Tepman +2 more |
2013-03-19 |
$6,887,000 |
| 7422637 |
Processing chamber configured for uniform gas flow |
Vincent Ku, Ling Chen, Hua Chung |
2008-09-09 |
$16,131,000 |
| 7138014 |
Electroless deposition apparatus |
Joseph Stevens, Dmitry Lubomirsky, Ian Pancham, Donald Olgado, Yeuk-Fai Edwin Mok |
2006-11-21 |
$24,429,000 |
| 7048837 |
End point detection for sputtering and resputtering |
Sasson Somekh, Marc Schweitzer, John C. Forster, Zheng Xu, Roderick C. Mosely +1 more |
2006-05-23 |
$10,996,000 |
| 6824612 |
Electroless plating system |
Joseph Stevens, Dmitry Lubomirsky, Ian Pancham, Donald Olgado, Yeuk-Fai Edwin Mok +1 more |
2004-11-30 |
$15,899,000 |
| 6799939 |
Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers |
Robert B. Lowrance |
2004-10-05 |
$71,609,000 |
| 6783639 |
Coils for generating a plasma and for sputtering |
Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Avi Tepman +2 more |
2004-08-31 |
$40,709,000 |
| 6640151 |
Multi-tool control system, method and medium |
Sasson Somekh |
2003-10-28 |
$43,198,000 |
| 6575737 |
Method and apparatus for improved substrate handling |
Ilya Perlov, Alexey Goder, Evgueni Gantvarg |
2003-06-10 |
$35,747,000 |
| 6486444 |
Load-lock with external staging area |
Kevin Fairbairn, Christopher T. Lane, Kelly Colborne |
2002-11-26 |
$35,140,000 |
| 6468353 |
Method and apparatus for improved substrate handling |
Ilya Perlov, Alexey Goder, Eugene Gantvarg |
2002-10-22 |
$32,970,000 |
| 6409890 |
Method and apparatus for forming a uniform layer on a workpiece during sputtering |
Zheng Xu, Praburam Gopalraja, John C. Forster, Ralf Hofmann, Anantha K. Subramani |
2002-06-25 |
$39,568,000 |
| 6368469 |
Coils for generating a plasma and for sputtering |
Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Avi Tepman +2 more |
2002-04-09 |
$34,803,000 |
| 6254746 |
Recessed coil for generating a plasma |
Anantha K. Subramani, John C. Forster, Bradley O. Stimson, Sergio Edelstein, Avi Tepman +1 more |
2001-07-03 |
$77,440,000 |
| 6102164 |
Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers |
William McClintock, Robert B. Lowrance |
2000-08-15 |
$106,756,000 |
| 5879127 |
Robot assembly |
Robert B. Lowrance, Avi Tepman |
1999-03-09 |
$25,183,000 |
| 5868847 |
Clamp ring for shielding a substrate during film layer deposition |
Aihua Chen, Zheng Xu, Avi Tepman, Igor Kogan |
1999-02-09 |
$105,990,000 |
| 5857368 |
Apparatus and method for fabricating metal paths in semiconductor substrates through high pressure extrusion |
Stephen J. Blumenkranz, Eric C. Williams, Richard K. Reber |
1999-01-12 |
$85,577,000 |
| 5810931 |
High aspect ratio clamp ring |
Joe Stevens, Igor Kogan |
1998-09-22 |
$14,561,000 |
| 5763851 |
Slotted RF coil shield for plasma deposition system |
John C. Forster, Aihua Chen, Robert B. Lowrance, Ralf Hofmann, Zheng Xu +1 more |
1998-06-09 |
$16,327,000 |
| 5690795 |
Screwless shield assembly for vacuum processing chambers |
Michael Rosenstein, Stephen Bruce Brodsky |
1997-11-25 |
|
| 5678980 |
Robot assembly |
Avi Tepman, Robert B. Lowrance |
1997-10-21 |
$85,045,000 |
| 5656093 |
Wafer spacing mask for a substrate support chuck and method of fabricating same |
Vincent E. Burkhart, Michael Sugarman |
1997-08-12 |
$114,957,000 |
| 5556248 |
Semiconductor wafer cassette transfer system |
— |
1996-09-17 |
$16,373,000 |
| 5484011 |
Method of heating and cooling a wafer during semiconductor processing |
Avi Tepman, Dana L. Andrews |
1996-01-16 |
$37,781,000 |
