| 9177842 |
Degassing apparatus adapted to process substrates in multiple tiers with second actuator |
Eric A. Englhardt, Richard Giljum, Jeffrey C. Hudgens, Michael R. Rice, Sushant S. Koshti |
2015-11-03 |
| 6929774 |
Method and apparatus for heating and cooling substrates |
Ratson Morad, Ho Seon Shin, Robin Cheung |
2005-08-16 |
| 6658763 |
Method for heating and cooling substrates |
Ratson Morad, Ho Seon Shin, Robin Cheung |
2003-12-09 |
| 6477787 |
Method and apparatus for heating and cooling substrates |
Ratson Morad, Ho Seon Shin, Robin Cheung |
2002-11-12 |
| 6357143 |
Method and apparatus for heating and cooling substrates |
Ratson Morad, Ho Seon Shin, Robin Cheung |
2002-03-19 |
| 6276072 |
Method and apparatus for heating and cooling substrates |
Ratson Morad, Ho Seon Shin, Robin Cheung |
2001-08-21 |
| 5885428 |
Method and apparatus for both mechanically and electrostatically clamping a wafer to a pedestal within a semiconductor wafer processing system |
— |
1999-03-23 |
| 5868847 |
Clamp ring for shielding a substrate during film layer deposition |
Aihua Chen, Zheng Xu, Howard Grunes, Avi Tepman |
1999-02-09 |
| 5810931 |
High aspect ratio clamp ring |
Joe Stevens, Howard Grunes |
1998-09-22 |
