Issued Patents All Time
Showing 26–50 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7335282 | Sputtering using an unbalanced magnetron | Jianming Fu, Fusen Chen, John C. Forster | 2008-02-26 |
| 7253109 | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system | Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Suraj Rengarajan +7 more | 2007-08-07 |
| 7163607 | Process kit for improved power coupling through a workpiece in a semiconductor wafer processing system | Bradley O. Stimson, Mitsuhiro Kaburaki, John C. Forster, Eric Delaurentis, Patricia Rodriguez +1 more | 2007-01-16 |
| 6991709 | Multi-step magnetron sputtering process | Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu, Wei Wang +1 more | 2006-01-31 |
| 6974771 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Fusen Chen, Ling Chen, Walter Glenn, Jianming Fu | 2005-12-13 |
| 6911124 | Method of depositing a TaN seed layer | Xianmin Tang, Suraj Rengarajan, John C. Forster, Jianming Fu, Peijun Ding | 2005-06-28 |
| 6899796 | Partially filling copper seed layer | Wei Wang, Anantha K. Subramani, Jianming Fu, Jick Yu, Fusen Chen | 2005-05-31 |
| 6887786 | Method and apparatus for forming a barrier layer on a substrate | Hong Mei Zhang, Xianmin Tang, John C. Forster, Jick Yu | 2005-05-03 |
| 6884329 | Diffusion enhanced ion plating for copper fill | Wei Wang, Anantha K. Subramani, Jianming Fu, Jick Yu, Fusen Chen | 2005-04-26 |
| 6837975 | Asymmetric rotating sidewall magnet ring for magnetron sputtering | Wei Wang | 2005-01-04 |
| 6824658 | Partial turn coil for generating a plasma | Bradley O. Stimson | 2004-11-30 |
| 6790323 | Self ionized sputtering using a high density plasma source | Jianming Fu, Fusen Chen, John E. Foster | 2004-09-14 |
| 6790326 | Magnetron for a vault shaped sputtering target having two opposed sidewall magnets | Anantha K. Subramani, Umesh M. Kelkar, Jianming Fu | 2004-09-14 |
| 6787006 | Operating a magnetron sputter reactor in two modes | Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu, Wei Wang +1 more | 2004-09-07 |
| 6783639 | Coils for generating a plasma and for sputtering | Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard Grunes +2 more | 2004-08-31 |
| 6784096 | Methods and apparatus for forming barrier layers in high aspect ratio vias | Fusen Chen, Ling Chen, Walter Glenn, Jianming Fu | 2004-08-31 |
| 6758949 | Magnetically confined metal plasma sputter source with magnetic control of ion and neutral densities | Wei Wang, Jianming Fu | 2004-07-06 |
| 6730196 | Auxiliary electromagnets in a magnetron sputter reactor | Wei Wang, Jianming Fu | 2004-05-04 |
| 6723214 | Apparatus for improved power coupling through a workpiece in a semiconductor wafer processing system | Bradley O. Stimson, Mitsuhiro Kaburaki, John C. Forster, Eric Delaurentis, Patricia Rodriguez +1 more | 2004-04-20 |
| 6709553 | Multiple-step sputter deposition | Wei Wang, Jianming Fu | 2004-03-23 |
| 6673724 | Pulsed-mode RF bias for side-wall coverage improvement | John C. Forster, Bradley O. Stimson, Liubo Hong | 2004-01-06 |
| 6660134 | Feedthrough overlap coil | Zheng Xu, Michael Rosenstein, John C. Forster | 2003-12-09 |
| 6485618 | Integrated copper fill process | Jianming Fu, Fusen Chen, Girish Dixit, Zheng Xu, Sankaram Athreya +2 more | 2002-11-26 |
| 6485617 | Sputtering method utilizing an extended plasma region | Jianming Fu | 2002-11-26 |
| 6461483 | Method and apparatus for performing high pressure physical vapor deposition | Bradley O. Stimson, John C. Forster, Wei Wang | 2002-10-08 |