| 10047430 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering |
Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more |
2018-08-14 |
$24,993,000 |
| 9991157 |
Method for depositing a diffusion barrier layer and a metal conductive layer |
Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more |
2018-06-05 |
$36,422,000 |
| 9390970 |
Method for depositing a diffusion barrier layer and a metal conductive layer |
Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more |
2016-07-12 |
$13,832,000 |
| 8696875 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering |
Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more |
2014-04-15 |
$21,336,000 |
| 8668816 |
Self-ionized and inductively-coupled plasma for sputtering and resputtering |
Peijun Ding, Rong Tao, Zheng Xu, Daniel C. Lubben, Suraj Rengarajan +7 more |
2014-03-11 |
$12,153,000 |
| 8158511 |
Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features |
Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more |
2012-04-17 |
$9,496,000 |
| 7989343 |
Method of depositing a uniform metal seed layer over a plurality of recessed semiconductor features |
Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more |
2011-08-02 |
$5,317,000 |
| 7795138 |
Method of depositing a metal seed layer over recessed feature surfaces in a semiconductor substrate |
Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more |
2010-09-14 |
$9,681,000 |
| 7687909 |
Metal / metal nitride barrier layer for semiconductor device applications |
Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more |
2010-03-30 |
$22,482,000 |
| 7589016 |
Method of depositing a sculptured copper seed layer |
Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more |
2009-09-15 |
$12,042,000 |
| 7547644 |
Methods and apparatus for forming barrier layers in high aspect ratio vias |
Ling Chen, Walter Glenn, Praburam Gopalraja, Jianming Fu |
2009-06-16 |
$14,977,000 |
| 7381639 |
Method of depositing a metal seed layer on semiconductor substrates |
Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more |
2008-06-03 |
$34,287,000 |
| 7335282 |
Sputtering using an unbalanced magnetron |
Jianming Fu, Praburam Gopalraja, John C. Forster |
2008-02-26 |
|
| 7294574 |
Sputter deposition and etching of metallization seed layer for overhang and sidewall improvement |
Peijun Ding, Fuhong Zhang, Hsien-Lung Yang, Michael Miller, Jianming Fu +2 more |
2007-11-13 |
$11,470,000 |
| 7253109 |
Method of depositing a tantalum nitride/tantalum diffusion barrier layer system |
Peijun Ding, Zheng Xu, Hong Mei Zhang, Xianmin Tang, Praburam Gopalraja +7 more |
2007-08-07 |
$22,752,000 |
| 7112528 |
Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminum plug |
Liang-Yuh Chen, Ted Guo, Roderick Craig Mosley |
2006-09-26 |
$15,511,000 |
| 7074714 |
Method of depositing a metal seed layer on semiconductor substrates |
Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more |
2006-07-11 |
$12,872,000 |
| 7026238 |
Reliability barrier integration for Cu application |
Ming Xi, Paul Smith, Ling Chen, Michael Yang, Mei Chang +2 more |
2006-04-11 |
$23,457,000 |
| 6991709 |
Multi-step magnetron sputtering process |
Praburam Gopalraja, Jianming Fu, Girish Dixit, Zheng Xu, Wei Wang +1 more |
2006-01-31 |
$13,979,000 |
| 6974771 |
Methods and apparatus for forming barrier layers in high aspect ratio vias |
Ling Chen, Walter Glenn, Praburam Gopalraja, Jianming Fu |
2005-12-13 |
$38,901,000 |
| 6919275 |
Method of preventing diffusion of copper through a tantalum-comprising barrier layer |
Tony P. Chiang, Gongda Yao, Peijun Ding, Barry Chin, Gene Y. Kohara +2 more |
2005-07-19 |
$46,519,000 |
| 6913680 |
Method of application of electrical biasing to enhance metal deposition |
Bo Zheng, Hougong Wang, Girish Dixit |
2005-07-05 |
$11,772,000 |
| 6899796 |
Partially filling copper seed layer |
Wei Wang, Anantha K. Subramani, Jianming Fu, Praburam Gopalraja, Jick Yu |
2005-05-31 |
$12,544,000 |
| 6884329 |
Diffusion enhanced ion plating for copper fill |
Wei Wang, Anantha K. Subramani, Jianming Fu, Praburam Gopalraja, Jick Yu |
2005-04-26 |
$27,390,000 |
| 6797620 |
Method and apparatus for improved electroplating fill of an aperture |
John Lewis, Srinivas Gandikota, Sivakami Ramanathan, Girish Dixit, Robin Cheung |
2004-09-28 |
$20,273,000 |
