| 11177131 |
Method and apparatuses for reducing porogen accumulation from a UV-cure chamber |
Lisa Gytri, Jeff Gordon, James Lee, Carmen Balderrama, Joseph Brett Harris +3 more |
2021-11-16 |
|
| 10230018 |
Substrate used for III-V-nitride growth and manufacturing method thereof |
Maosheng Hao, Genru Yuan, Yue Ma |
2019-03-12 |
|
| 10121682 |
Purging of porogen from UV cure chamber |
Eugene Smargiassi, Stephen Yu-Hong Lau, George D. Kamian |
2018-11-06 |
|
| 10020197 |
Method for reducing porogen accumulation from a UV-cure chamber |
Lisa Gytri, Jeff Gordon, James Lee, Carmen Balderrama, Joseph Brett Harris +3 more |
2018-07-10 |
|
| 9832493 |
Method and apparatus for processing audio/video file |
Huaiyin Guo, Xu Zhang |
2017-11-28 |
|
| 9384959 |
Purging of porogen from UV cure chamber |
Eugene Smargiassi, Stephen Yu-Hong Lau, George D. Kamian |
2016-07-05 |
|
| 9073100 |
Method and apparatuses for reducing porogen accumulation from a UV-cure chamber |
Lisa Gytri, Jeff Gordon, James Lee, Carmen Balderrama, Joseph Brett Harris +3 more |
2015-07-07 |
|
| 9031685 |
Atomic layer deposition apparatus |
Barry Chin, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ken Kaung Lai +1 more |
2015-05-12 |
$26,933,000 |
| 9012334 |
Formation of a tantalum-nitride layer |
Sean M. Seutter, Michael Yang |
2015-04-21 |
$14,570,000 |
| 8734663 |
Purging of porogen from UV cure chamber |
Eugene Smargiassi, Stephen Yu-Hong Lau, George D. Kamian |
2014-05-27 |
|
| 8626330 |
Atomic layer deposition apparatus |
Barry Chin, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ken Kaung Lai +1 more |
2014-01-07 |
$24,959,000 |
| 8518210 |
Purging of porogen from UV cure chamber |
Eugene Smargiassi, Stephen Yu-Hong Lau, George D. Kamian |
2013-08-27 |
|
| 8282768 |
Purging of porogen from UV cure chamber |
Eugene Smargiassi, Stephen Yu-Hong Lau, George D. Kamian |
2012-10-09 |
|
| 8123860 |
Apparatus for cyclical depositing of thin films |
Randhir P. S. Thakur, Alfred Mak, Walter Glenn, Ahmad Khan, Ayad A. Al-Shaikh +2 more |
2012-02-28 |
$8,688,000 |
| 8114789 |
Formation of a tantalum-nitride layer |
Sean M. Seutter, Michael Yang |
2012-02-14 |
$12,695,000 |
| 8027746 |
Atomic layer deposition apparatus |
Barry Chin, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ken Kaung Lai +1 more |
2011-09-27 |
$17,577,000 |
| 7867914 |
System and method for forming an integrated barrier layer |
Michael Yang, Hui Zhang |
2011-01-11 |
$9,486,000 |
| 7860597 |
Atomic layer deposition apparatus |
Barry Chin, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ken Kaung Lai +1 more |
2010-12-28 |
$12,129,000 |
| 7781326 |
Formation of a tantalum-nitride layer |
Sean M. Seutter, Michael Yang |
2010-08-24 |
$4,612,000 |
| 7779784 |
Apparatus and method for plasma assisted deposition |
Chen-An Chen, Avgerinos V. Gelatos, Michael Yang, Mark Hytros |
2010-08-24 |
$4,612,000 |
| 7745333 |
Methods for depositing tungsten layers employing atomic layer deposition techniques |
Ken Kaung Lai, Ravi Rajagopalan, Amit Khandelwal, Madhu Moorthy, Srinivas Gandikota +9 more |
2010-06-29 |
$7,165,000 |
| 7732325 |
Plasma-enhanced cyclic layer deposition process for barrier layers |
Michael Yang, Toshio Itoh |
2010-06-08 |
$8,435,000 |
| 7709385 |
Method for depositing tungsten-containing layers by vapor deposition techniques |
Ashok Sinha, Moris Kori, Alfred Mak, Xinliang Lu, Ken Kaung Lai +1 more |
2010-05-04 |
$14,487,000 |
| 7695563 |
Pulsed deposition process for tungsten nucleation |
Xinliang Lu, Ping Jian, Jong Hyun Yoo, Ken Kaung Lai, Alfred Mak +1 more |
2010-04-13 |
$8,039,000 |
| 7674715 |
Method for forming tungsten materials during vapor deposition processes |
Moris Kori, Alfred Mak, Jeong Soo Byun, Lawrence Chung-Lai Lei, Hua Chung +1 more |
2010-03-09 |
$8,227,000 |
