Issued Patents All Time
Showing 26–50 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7660644 | Atomic layer deposition apparatus | Barry Chin, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ken Kaung Lai +1 more | 2010-02-09 |
| 7605083 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos +7 more | 2009-10-20 |
| 7473638 | Plasma-enhanced cyclic layer deposition process for barrier layers | Michael Yang, Toshio Itoh | 2009-01-06 |
| 7465666 | Method for forming tungsten materials during vapor deposition processes | Moris Kori, Alfred Mak, Jeong Soo Byun, Lawrence Chung-Lai Lei, Hua Chung +1 more | 2008-12-16 |
| 7465665 | Method for depositing tungsten-containing layers by vapor deposition techniques | Ashok Sinha, Moris Kori, Alfred Mak, Xinliang Lu, Ken Kaung Lai +1 more | 2008-12-16 |
| 7405158 | Methods for depositing tungsten layers employing atomic layer deposition techniques | Ken Kaung Lai, Ravi Rajagopalan, Amit Khandelwal, Madhu Moorthy, Srinivas Gandikota +9 more | 2008-07-29 |
| 7396565 | Multiple precursor cyclical deposition system | Michael Yang, Hyungsuk Alexander Yoon, Hui Zhang, Hongbin Fang | 2008-07-08 |
| 7384867 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos +7 more | 2008-06-10 |
| 7279432 | System and method for forming an integrated barrier layer | Michael Yang, Hui Zhang | 2007-10-09 |
| 7235486 | Method for forming tungsten materials during vapor deposition processes | Moris Kori, Alfred Mak, Jeong Soo Byun, Lawrence Chung-Lai Lei, Hua Chung +1 more | 2007-06-26 |
| 7223323 | Multi-chemistry plating system | Michael Yang, Russell C. Ellwanger, Eric Bramwell Britcher, Bernardo Donoso, Lily Pang +11 more | 2007-05-29 |
| 7220673 | Method for depositing tungsten-containing layers by vapor deposition techniques | Ashok Sinha, Moris Kori, Alfred Mak, Xinliang Lu, Ken Kaung Lai +1 more | 2007-05-22 |
| 7211144 | Pulsed nucleation deposition of tungsten layers | Xinliang Lu, Ping Jian, Jong Hyun Yoo, Ken Kaung Lai, Alfred Mak +1 more | 2007-05-01 |
| 7201803 | Valve control system for atomic layer deposition chamber | Siqing Lu, Yu-Chia Chang, Dongxi Sun, Vinh Dang, Michael Yang +2 more | 2007-04-10 |
| 7175713 | Apparatus for cyclical deposition of thin films | Randhir P. S. Thakur, Alfred Mak, Walter Glenn, Ahmad Khan, Ayad A. Al-Shaikh +2 more | 2007-02-13 |
| 7115494 | Method and system for controlling the presence of fluorine in refractory metal layers | Ashok Sinha, Moris Kori, Alfred Mak, Jeong Soo Byun, Lawrence Chung-Lai Lei +1 more | 2006-10-03 |
| 7101795 | Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer | Ashok Sinha, Moris Kori, Alfred Mak, Xinliang Lu, Ken Kaung Lai +1 more | 2006-09-05 |
| 7094685 | Integration of titanium and titanium nitride layers | Michael Yang, Toshio Itoh | 2006-08-22 |
| 7094680 | Formation of a tantalum-nitride layer | Sean M. Seutter, Michael Yang | 2006-08-22 |
| 7085616 | Atomic layer deposition apparatus | Barry Chin, Alfred Mak, Lawrence Chung-Lai Lei, Hua Chung, Ken Kaung Lai +1 more | 2006-08-01 |
| 7033922 | Method and system for controlling the presence of fluorine in refractory metal layers | Moris Kori, Alfred Mak, Jeong Soo Byun, Lawrence Chung-Lai Lei, Hua Chung +1 more | 2006-04-25 |
| 7026238 | Reliability barrier integration for Cu application | Paul Smith, Ling Chen, Michael Yang, Mei Chang, Fusen Chen +2 more | 2006-04-11 |
| 6998014 | Apparatus and method for plasma assisted deposition | Chen-An Chen, Avgerinos V. Gelatos, Michael Yang, Mark Hytros | 2006-02-14 |
| 6951804 | Formation of a tantalum-nitride layer | Sean M. Seutter, Michael Yang | 2005-10-04 |
| 6939804 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Frederick Wu, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos +7 more | 2005-09-06 |