Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9032906 | Apparatus and process for plasma-enhanced atomic layer deposition | Paul F. Ma, Kavita Shah, Dien-Yeh Wu, Seshadri Ganguli, Christophe Marcadal +1 more | 2015-05-19 |
| 7850779 | Apparatus and process for plasma-enhanced atomic layer deposition | Paul F. Ma, Kavita Shah, Dien-Yeh Wu, Seshadri Ganguli, Christophe Marcadal +1 more | 2010-12-14 |
| 7833358 | Method of recovering valuable material from exhaust gas stream of a reaction chamber | Schubert S. Chu, Christophe Marcadal, Seshadri Ganguli, Dien-Yeh Wu, Kavita Shah +1 more | 2010-11-16 |
| 7682946 | Apparatus and process for plasma-enhanced atomic layer deposition | Paul F. Ma, Kavita Shah, Dien-Yeh Wu, Seshadri Ganguli, Christophe Marcadal +1 more | 2010-03-23 |
| 7605083 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos, Mei Chang +7 more | 2009-10-20 |
| 7384867 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos, Mei Chang +7 more | 2008-06-10 |
| 6939804 | Formation of composite tungsten films | Ken Kaung Lai, Jeong Soo Byun, Ramanujapuran A. Srinivas, Avgerinos V. Gelatos, Mei Chang +7 more | 2005-09-06 |
| 6548402 | Method of depositing a thick titanium nitride film | Shulin Wang, Ming Xi, Ramanujapuram A. Srinivas, Yehuda Demayo, Zvi Lando +2 more | 2003-04-15 |
| 6524952 | Method of forming a titanium silicide layer on a substrate | Ramanujapuram A. Srinivas, Brian Metzger, Shulin Wang | 2003-02-25 |
| 6482746 | Computer readable medium for controlling a method of cleaning a process chamber | Anand Vasudev, Toshio Itoh, Ramamujapuram A. Srinivas, Li Wu, Brian Boyle +1 more | 2002-11-19 |
| 6242347 | Method for cleaning a process chamber | Anand Vasudev, Toshio Itoh, Ramanujapuram A. Srinivas, Li Wu, Brian Boyle +1 more | 2001-06-05 |
| 6221174 | Method of performing titanium/titanium nitride integration | Fufa Chen, Yin Lin, Jianhua Hu, Ming Xi, Li Wu | 2001-04-24 |