Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12158437 | XPS metrology for process control in selective deposition | Charles Thomas Larson, Wei Ti Lee | 2024-12-03 |
| 11895205 | Systems and methods for restricting generation and delivery of insights to second data source providers | Oleg Rogynskyy, David Flink, Wei Hai | 2024-02-06 |
| 11680915 | XPS metrology for process control in selective deposition | Charles Thomas Larson, Wei Ti Lee | 2023-06-20 |
| 11346795 | XPS metrology for process control in selective deposition | Charles Thomas Larson, Wei Ti Lee | 2022-05-31 |
| 11277484 | Systems and methods for restricting generation and delivery of insights to second data source providers | Oleg Rogynskyy, David Flink, Wei Hai | 2022-03-15 |
| 10860633 | Systems and methods for inferring a time zone of a node profile using electronic activities | Oleg Rogynskyy, Tetiana Lutsaievska, Wei Hai | 2020-12-08 |
| 10801978 | XPS metrology for process control in selective deposition | Charles Thomas Larson, Wei Ti Lee | 2020-10-13 |
| 10657130 | Systems and methods for generating a performance profile of a node profile including field-value pairs using electronic activities | Devin Rice, Adam Draper, Wei Hai, Jose Alberto Muniz Navarro, Oleg Rogynskyy | 2020-05-19 |
| 10545980 | Systems and methods for restricting generation and delivery of insights to second data source providers | Oleg Rogynskyy, David Flink, Wei Hai | 2020-01-28 |
| 10504050 | Systems and methods for managing electronic activity driven targets | Oleg Rogynskyy, Wei Hai | 2019-12-10 |
| 9032906 | Apparatus and process for plasma-enhanced atomic layer deposition | Paul F. Ma, Dien-Yeh Wu, Seshadri Ganguli, Christophe Marcadal, Frederick Wu +1 more | 2015-05-19 |
| 8927423 | Methods for annealing a contact metal layer to form a metal silicidation layer | Xinyu Fu, Wei V. Tang, Srinivas Gandikota, San Yu, Avgerinos V. Gelatos | 2015-01-06 |
| 8586479 | Methods for forming a contact metal layer in semiconductor devices | Xinyu Fu, Srinivas Gandikota, Sang Ho Yu, Yu Lei | 2013-11-19 |
| 7989339 | Vapor deposition processes for tantalum carbide nitride materials | Haichun Yang, Schubert S. Chu | 2011-08-02 |
| 7910165 | Ruthenium layer formation for copper film deposition | Seshadri Ganguli, Nirmaya Maity, Mei Chang | 2011-03-22 |
| 7850779 | Apparatus and process for plasma-enhanced atomic layer deposition | Paul F. Ma, Dien-Yeh Wu, Seshadri Ganguli, Christophe Marcadal, Frederick Wu +1 more | 2010-12-14 |
| 7833358 | Method of recovering valuable material from exhaust gas stream of a reaction chamber | Schubert S. Chu, Frederick Wu, Christophe Marcadal, Seshadri Ganguli, Dien-Yeh Wu +1 more | 2010-11-16 |
| 7691442 | Ruthenium or cobalt as an underlayer for tungsten film deposition | Srinivas Gandikota, Madhu Moorthy, Amit Khandelwal, Avgerinos V. Gelatos, Mei Chang +1 more | 2010-04-06 |
| 7682946 | Apparatus and process for plasma-enhanced atomic layer deposition | Paul F. Ma, Dien-Yeh Wu, Seshadri Ganguli, Christophe Marcadal, Frederick Wu +1 more | 2010-03-23 |
| 7678298 | Tantalum carbide nitride materials by vapor deposition processes | Haichun Yang, Schubert S. Chu | 2010-03-16 |
| 7585762 | Vapor deposition processes for tantalum carbide nitride materials | Haichun Yang, Schubert S. Chu | 2009-09-08 |
| 7429402 | Ruthenium as an underlayer for tungsten film deposition | Srinivas Gandikota, Madhu Moorthy, Amit Khandelwal, Avgerinos V. Gelatos, Mei Chang +1 more | 2008-09-30 |
| 7252944 | Methods and compositions for modulating cell proliferation | Sungjoon Kim | 2007-08-07 |