Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
WL

Wei Ti Lee — 38 Patents

NINova Measuring Instruments: 14 patents #8 of 108Top 8%
Applied Materials: 13 patents #1,046 of 7,310Top 15%
ATAdesto Technologies: 6 patents #21 of 52Top 45%
RIRevera, Incorporated: 1 patents #14 of 24Top 60%
IBM: 1 patents #44,878 of 70,183Top 65%
GUGlobalfoundries U.S.: 1 patents #363 of 665Top 55%
CRCrossbar: 1 patents #42 of 53Top 80%
NONova: 1 patents #39 of 75Top 55%
Planada, CA: #2 of 26 inventorsTop 8%
California: #12,412 of 386,348 inventorsTop 4%
Overall (All Time): #84,675 of 4,157,543Top 3%
38 Patents All Time
Wei Ti Lee has been granted 38 US patents while listed as an inventor at Nova Measuring Instruments. The first was granted in 2003 and the most recent in April 2025. Wei Ti Lee ranks #84,675 of 4,157,543 US inventors in our database (top 2.0%). Patent records list Wei Ti Lee in Planada, CA, US.

Patents per Year

Patents granted per year, 2003 to 2025Bar chart with a peak of 5 patents in 2024.peak 52003: 2 patents20032004: 1 patents2008: 2 patents20082010: 3 patents2011: 1 patents20112013: 1 patents2014: 4 patents20142015: 2 patents2016: 1 patents20162017: 3 patents2018: 3 patents20182020: 3 patents2021: 1 patents20212022: 2 patents2023: 3 patents20232024: 5 patents2025: 1 patents2025

Issued Patents All Time

Showing 1–25 of 38 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12281893 Characterizing and measuring in small boxes using XPS with multiple measurements Heath A. Pois, Laxmi WARAD, Dmitry Kislitsyn, Parker Lund, Benny Tseng +2 more 2025-04-22
12158437 XPS metrology for process control in selective deposition Charles Thomas Larson, Kavita Shah 2024-12-03 $57,184,000
12066391 Method and system for non-destructive metrology of thin layers Heath A. Pois, Mark Klare, Cornel Bozdog 2024-08-20 $59,912,000
11997932 Resistive switching memory having confined filament formation and methods thereof Sundar Narayanan, Wee Chen Gan, Natividad Vasquez 2024-05-28
11988502 Characterizing and measuring in small boxes using XPS with multiple measurements Heath A. Pois, Laxmi WARAD, Dmitry Kislitsyn, Parker Lund, Benny Tseng +2 more 2024-05-21 $46,022,000
11906451 Method and system for non-destructive metrology of thin layers Heath A. Pois, Mark Klare, Cornel Bozdog, Alok Vaid 2024-02-20
11733035 Feed-forward of multi-layer and multi-process information using XPS and XRF technologies Heath A. Pois, Lawrence V. Bot, Michael Kwan, Mark Klare, Charles Thomas Larson 2023-08-22 $21,818,000
11680915 XPS metrology for process control in selective deposition Charles Thomas Larson, Kavita Shah 2023-06-20 $22,141,000
11668663 Method and system for non-destructive metrology of thin layers Heath A. Pois, Mark Klare, Cornel Bozdog 2023-06-06 $22,360,000
11346795 XPS metrology for process control in selective deposition Charles Thomas Larson, Kavita Shah 2022-05-31 $26,723,000
11295969 Hybridization for characterization and metrology Gangadhara Raja Muthinti, Matthew Sendelbach, Roy Koret, Aron Cepler 2022-04-05 $5,706,000
11029148 Feed-forward of multi-layer and multi-process information using XPS and XRF technologies Heath A. Pois, Lawrence V. Bot, Michael Kwan, Mark Klare, Charles Thomas Larson 2021-06-08 $10,107,000
10801978 XPS metrology for process control in selective deposition Charles Thomas Larson, Kavita Shah 2020-10-13 $11,967,000
10648802 Feed-forward of multi-layer and multi-process information using XPS and XRF technologies Heath A. Pois, Lawrence V. Bot, Michael Kwan, Mark Klare, Charles Thomas Larson 2020-05-12 $8,932,000
10533961 Method and system for non-destructive metrology of thin layers Heath A. Pois, Mark Klare, Cornel Bozdog 2020-01-14 $3,001,000
10082390 Feed-forward of multi-layer and multi-process information using XPS and XRF technologies Heath A. Pois, Lawrence V. Bot, Michael Kwan, Mark Klare, Charles Thomas Larson 2018-09-25 $6,411,000
9952166 Silicon germanium thickness and composition determination using combined XPS and XRF technologies Heath A. Pois 2018-04-24 $8,263,000
9926639 Methods for forming barrier/seed layers for copper interconnect structures Hoon Kim, Sang Ho Yu, Seshadri Ganguli, Hyoung-Chan Ha, Sang-Hyeob Lee 2018-03-27 $21,583,000
9818939 Resistive switching devices having a switching layer and an intermediate electrode layer and methods of formation thereof John Ross Jameson, John Sanchez, Yi Ma, Venkatesh P. Gopinath, Foroozan Sarah Koushan 2017-11-14 $3,343,000
9594035 Silicon germanium thickness and composition determination using combined XPS and XRF technologies Heath A. Pois 2017-03-14
9593417 Gas line weldment design and process for CVD aluminum Ted Guo, Steve H. Chiao, Alan A. Ritchie 2017-03-14 $16,778,000
9252359 Resistive switching devices having a switching layer and an intermediate electrode layer and methods of formation thereof John Ross Jameson, John Sanchez, Foroozan Sarah Koushan 2016-02-02 $1,319,000
9129945 Formation of liner and barrier for tungsten as gate electrode and as contact plug to reduce resistance and enhance device performance Sang-Hyeob Lee, Sang Ho Yu, Seshadri Ganguli, Hyoung-Chan Ha, Hoon Kim 2015-09-08 $6,271,000
9099633 Solid electrolyte memory elements with electrode interface for improved performance Chakravarthy Gopalan, Yi Ma, Jeffrey A. Shields 2015-08-04
8895953 Programmable memory elements, devices and methods having physically localized structure Jeffrey A. Shields, John Ross Jameson 2014-11-25