Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12086528 | Secure fingerprinting of a trusted photomask | Scott D. Halle, Gauri Karve, Effendi Leobandung, Ravi K. Bonam | 2024-09-10 |
| 11714045 | Techniques for characterizing films on optically clear substrates using ellipsometry | Vivek Gupta | 2023-08-01 |
| 11688632 | Semiconductor device with linerless contacts | Alex Joseph Varghese, Marc A. Bergendahl, Andrew M. Greene, Dallas Lea, Matthew T. Shoudy +2 more | 2023-06-27 |
| 11619877 | Determination of optical roughness in EUV structures | Ravi K. Bonam | 2023-04-04 |
| 11480868 | Determination of optical roughness in EUV structures | Ravi K. Bonam | 2022-10-25 |
| 11309221 | Single metallization scheme for gate, source, and drain contact integration | Andrew M. Greene, Victor Chan | 2022-04-19 |
| 11295969 | Hybridization for characterization and metrology | Matthew Sendelbach, Roy Koret, Aron Cepler, Wei Ti Lee | 2022-04-05 |
| 11276636 | Adjustable via dimension and chamfer angle | Lawrence A. Clevenger, Koichi Motoyama, Cornelius Brown Peethala, Benjamin D. Briggs, Michael Rizzolo | 2022-03-15 |
| 11101172 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Koichi Motoyama, Benjamin D. Briggs, Cornelius Brown Peethala, Lawrence A. Clevenger | 2021-08-24 |
| 11054250 | Multi-channel overlay metrology | Chiew-Seng Koay, Siva Kanakasabapathy, Nelson Felix | 2021-07-06 |
| 10985076 | Single metallization scheme for gate, source, and drain contact integration | Andrew M. Greene, Victor Chan | 2021-04-20 |
| 10957646 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Cornelius Brown Peethala, Michael Rizzolo, Koichi Motoyama, Gen Tsutsui +2 more | 2021-03-23 |
| 10943990 | Gate contact over active enabled by alternative spacer scheme and claw-shaped cap | Andrew M. Greene, Victor Chan, Veeraraghavan S. Basker, Junli Wang, Kisik Choi +1 more | 2021-03-09 |
| 10923401 | Gate cut critical dimension shrink and active gate defect healing using selective deposition | Andrew M. Greene, Marc A. Bergendahl, Ekmini Anuja De Silva, Alex Joseph Varghese, Yann Mignot +2 more | 2021-02-16 |
| 10903111 | Semiconductor device with linerless contacts | Alex Joseph Varghese, Marc A. Bergendahl, Andrew M. Greene, Dallas Lea, Matthew T. Shoudy +2 more | 2021-01-26 |
| 10741609 | Pre-patterned etch stop for interconnect trench formation overlying embedded MRAM structures | Michael Rizzolo, Oscar van der Straten, Chih-Chao Yang | 2020-08-11 |
| 10658233 | Dielectric damage-free dual damascene Cu interconnects without barrier at via bottom | Koichi Motoyama, Benjamin D. Briggs, Cornelius Brown Peethala, Lawrence A. Clevenger | 2020-05-19 |
| 10586767 | Hybrid BEOL metallization utilizing selective reflection mask | Benjamin D. Briggs, Cornelius Brown Peethala, Michael Rizzolo, Koichi Motoyama, Gen Tsutsui +2 more | 2020-03-10 |
| 10139358 | Method for characterization of a layered structure | Lisa F. Edge, Shariq Siddiqui | 2018-11-27 |