GT

Gen Tsutsui

IBM: 34 patents #2,873 of 70,183Top 5%
RE Renesas Electronics: 5 patents #829 of 4,529Top 20%
Overall (All Time): #88,797 of 4,157,543Top 3%
37
Patents All Time

Issued Patents All Time

Showing 25 most recent of 37 patents

Patent #TitleCo-InventorsDate
12402352 Unipolar-FET implementation in stacked-FET CMOS Shogo Mochizuki 2025-08-26
12119264 Non-step nanosheet structure for stacked field-effect transistors Shogo Mochizuki 2024-10-15
11830946 Bottom source/drain for fin field effect transistors Heng Wu, Shogo Mochizuki, Kangguo Cheng 2023-11-28
11616140 Vertical transport field effect transistor with bottom source/drain Heng Wu, Lan Yu, Ruilong Xie 2023-03-28
11282962 Threshold voltage adjustment from oxygen vacancy by scavenge metal filling at gate cut (CT) Huimei Zhou, Ruqiang Bao, Michael P. Belyansky, Andrew M. Greene 2022-03-22
11276781 Bottom source/drain for fin field effect transistors Heng Wu, Shogo Mochizuki, Kangguo Cheng 2022-03-15
11183427 Differing device characteristics on a single wafer by selective etch Huimei Zhou, Shogo Mochizuki, Ruqiang Bao 2021-11-23
11056588 Vertical transport field effect transistor with bottom source/drain Heng Wu, Lan Yu, Ruilong Xie 2021-07-06
11037905 Formation of stacked vertical transport field effect transistors Heng Wu, Tenko Yamashita 2021-06-15
10971626 Interface charge reduction for SiGe surface Devendra K. Sadana, Dechao Guo, Joel P. de Souza, Ruqiang Bao, Stephen W. Bedell +3 more 2021-04-06
10957646 Hybrid BEOL metallization utilizing selective reflection mask Benjamin D. Briggs, Cornelius Brown Peethala, Michael Rizzolo, Koichi Motoyama, Ruqiang Bao +2 more 2021-03-23
10937648 Gate stack designs for analog and logic devices in dual channel Si/SiGe CMOS Choonghyun Lee, Ruqiang Bao, Dechao Guo 2021-03-02
10892181 Semiconductor device with mitigated local layout effects Huimei Zhou, Veeraraghavan S. Basker, Andrew M. Greene, Dechao Guo, Huiming Bu +1 more 2021-01-12
10685866 Fin isolation to mitigate local layout effects Huimei Zhou, Andrew M. Greene, Dechao Guo, Huiming Bu, Robert R. Robison +2 more 2020-06-16
10679901 Differing device characteristics on a single wafer by selective etch Huimei Zhou, Shogo Mochizuki, Ruqiang Bao 2020-06-09
10672910 Threshold voltage adjustment from oxygen vacancy by scavenge metal filling at gate cut (CT) Huimei Zhou, Ruqiang Bao, Michael P. Belyansky, Andrew M. Greene 2020-06-02
10658224 Method of fin oxidation by flowable oxide fill and steam anneal to mitigate local layout effects Huimei Zhou, Veeraraghavan S. Basker, Andrew M. Greene, Dechao Guo, Huiming Bu +1 more 2020-05-19
10586767 Hybrid BEOL metallization utilizing selective reflection mask Benjamin D. Briggs, Cornelius Brown Peethala, Michael Rizzolo, Koichi Motoyama, Ruqiang Bao +2 more 2020-03-10
10535773 FinFET with sigma recessed source/drain and un-doped buffer layer epitaxy for uniform junction formation Dechao Guo, Hemanth Jagannathan, Shogo Mochizuki, Chun-Chen Yeh 2020-01-14
10535517 Gate stack designs for analog and logic devices in dual channel Si/SiGe CMOS Choonghyun Lee, Ruqiang Bao, Dechao Guo 2020-01-14
10381479 Interface charge reduction for SiGe surface Devendra K. Sadana, Dechao Guo, Joel P. de Souza, Ruqiang Bao, Stephen W. Bedell +3 more 2019-08-13
10319811 Semiconductor device including fin having condensed channel region Hong He, Effendi Leobandung, Tenko Yamashita 2019-06-11
10312245 Laser spike annealing for solid phase epitaxy and low contact resistance in an SRAM with a shared pFET and nFET trench Zuoguang Liu, Heng Wu, Peng Xu 2019-06-04
10249542 Self-aligned doping in source/drain regions for low contact resistance Dechao Guo, Zuoguang Liu, Heng Wu 2019-04-02
10249758 FinFET with sigma recessed source/drain and un-doped buffer layer epitaxy for uniform junction formation Dechao Guo, Hemanth Jagannathan, Shogo Mochizuki, Chun-Chen Yeh 2019-04-02